5962-8605303LA — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

5962-8605303LA: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include features_provided: PROGRAMMABLE, output_logic_form: BIPOLAR METAL-OXIDE SEMICONDUCTOR, inclosure_material: CERAMIC, memory_device_type: PAL, storage_temp_range: -65.0 TO 150.0 CELSIUS DEGC, operating_temp_range: -55.0 TO 125.0 CELSIUS DEGC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-368-5362, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

5962-8605303LA

NSN: 5962-01-368-5362
FSC: 5962 — Microcircuits, Electronic
CAGE: 67268 — DLA LAND AND MARITIME DBA ENGINEERING AND TECHNICAL SUPPORT DIV DOCUMENT STANDARDIZATION DIVISION (STANDARD MICROCIRCUIT (USA)

SPECIFICATIONS

features_provided	PROGRAMMABLE
output_logic_form	BIPOLAR METAL-OXIDE SEMICONDUCTOR
inclosure_material	CERAMIC
memory_device_type	PAL
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	22 INPUT
hybrid_technology_type	MONOLITHIC
end_item_identification	EOTS E/I FSCM 76301
inclosure_configuration	DUAL-IN-LINE
terminal_surface_treatment	SOLDER
nondefinitive_spec/std_data	03 TYPE AND L CASE AND A FINISH
NSN	5962-01-368-5362

COMPONENT DIAGRAM

KEY FEATURES

•

HYBRID TECHNOLOGY TYPE: MONOLITHIC

•

INPUT CIRCUIT PATTERN: 22 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

FEATURES PROVIDED: PROGRAMMABLE

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

CURRENT RATING PER CHARACTERISTIC: 100.00 MILLIAMPERES MAXIMUM OUTPUT SINK

•

MEMORY DEVICE TYPE: PAL

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

HYBRID TECHNOLOGY TYPE	MONOLITHIC
INPUT CIRCUIT PATTERN	22 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
FEATURES PROVIDED	PROGRAMMABLE
INCLOSURE CONFIGURATION	DUAL-IN-LINE
CURRENT RATING PER CHARACTERISTIC	100.00 MILLIAMPERES MAXIMUM OUTPUT SINK
MEMORY DEVICE TYPE	PAL
CASE OUTLINE SOURCE AND DESIGNATOR	D-9 MIL-M-38510
SPECIFICATION/STANDARD DATA	67268-5962-86053 GOVERNMENT STANDARD

SUBSTITUTES & CROSS-REFERENCES 4

5962-8605303LXReference document

Same NSN cross-reference

Reference document — Secondary reference

5962-8605303LBReference document

Same NSN cross-reference

Reference document — Secondary reference

5962-86053Reference document

Same NSN cross-reference

Reference document — Identification reference

TIBPAL22VP10-25MJTBReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Terminal item — stock exhausted; no further procurementDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is 5962-8605303LA?

5962-8605303LA is a MICROCIRCUIT,MEMORY.

What parts can replace 5962-8605303LA?

There are 4 known substitutes for 5962-8605303LA: 5962-8605303LX, 5962-8605303LB, 5962-86053 and 1 more. Substitute compatibility should be verified for your specific system.

What is the NSN for 5962-8605303LA?

5962-8605303LA is cataloged in the U.S. Government catalog under NSN 5962-01-368-5362. This indicates validated use in U.S. government and defense supply chains.

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5962-8605303LA — MICROCIRCUIT,MEMORY

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