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5962-8552703LX — MICROCIRCUIT,MEMORY

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

5962-8552703LX: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.310 INCHES MAXIMUM IN, body_height: 0.185 INCHES MAXIMUM IN, body_length: 1.250 INCHES MAXIMUM IN, features_provided: MONOLITHIC AND BIPOLAR AND PROGRAMMABLE, output_logic_form: BIPOLAR METAL-OXIDE SEMICONDUCTOR, inclosure_material: METAL OR CERAMIC OR PLASTIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-261-4044, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
5962-8552703LX
NSN: 5962-01-261-4044
FSC: 5962 — Microcircuits, Electronic
CAGE: 67268 — DLA LAND AND MARITIME DBA ENGINEERING AND TECHNICAL SUPPORT DIV DOCUMENT STANDARDIZATION DIVISION (STANDARD MICROCIRCUIT (USA)
SPECIFICATIONS
body_width0.310 INCHES MAXIMUM IN
body_height0.185 INCHES MAXIMUM IN
body_length1.250 INCHES MAXIMUM IN
features_providedMONOLITHIC AND BIPOLAR AND PROGRAMMABLE
output_logic_formBIPOLAR METAL-OXIDE SEMICONDUCTOR
inclosure_materialMETAL OR CERAMIC OR PLASTIC
memory_device_typePROM
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
test_data_document96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern14 INPUT
inclosure_configurationDUAL-IN-LINE
NSN5962-01-261-4044
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN 5962-8552703LX MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
INPUT CIRCUIT PATTERN: 14 INPUT
•
INCLOSURE MATERIAL: METAL OR CERAMIC OR PLASTIC
•
TERMINAL SURFACE TREATMENT: SOLDER
•
BODY WIDTH: 0.310 INCHES MAXIMUM IN
•
BODY HEIGHT: 0.185 INCHES MAXIMUM IN
•
FEATURES PROVIDED: MONOLITHIC AND BIPOLAR AND PROGRAMMABLE
•
INCLOSURE CONFIGURATION: DUAL-IN-LINE
•
CURRENT RATING PER CHARACTERISTIC: 185.00 MILLIAMPERES MAXIMUM SUPPLY
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS
INPUT CIRCUIT PATTERN14 INPUT
INCLOSURE MATERIALMETAL OR CERAMIC OR PLASTIC
TERMINAL SURFACE TREATMENTSOLDER
BODY WIDTH0.310 INCHES MAXIMUM IN
BODY HEIGHT0.185 INCHES MAXIMUM IN
FEATURES PROVIDEDMONOLITHIC AND BIPOLAR AND PROGRAMMABLE
INCLOSURE CONFIGURATIONDUAL-IN-LINE
CURRENT RATING PER CHARACTERISTIC185.00 MILLIAMPERES MAXIMUM SUPPLY
MEMORY DEVICE TYPEPROM
CASE OUTLINE SOURCE AND DESIGNATORD-9 MIL-M-38510
SUBSTITUTES & CROSS-REFERENCES 4
AM27S47/BLAReference document
Same NSN cross-reference
Reference document — Secondary reference
5962-8552703LASame NSN cross-reference
Same NSN cross-reference
Also cataloged under this NSN
5962-85527Reference document
Same NSN cross-reference
Reference document — Identification reference
5962-8552703LBReference document
Same NSN cross-reference
Reference document — Secondary reference
LIFECYCLE
NSN statusActive· U.S. Government catalog
Acquisition advice: Insurance item — stocked against contingency demandNo demilitarization required
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FREQUENTLY ASKED QUESTIONS
What is 5962-8552703LX?
5962-8552703LX is a MICROCIRCUIT,MEMORY.
What parts can replace 5962-8552703LX?
There are 4 known substitutes for 5962-8552703LX: AM27S47/BLA, 5962-8552703LA, 5962-85527 and 1 more. Substitute compatibility should be verified for your specific system.
What is the NSN for 5962-8552703LX?
5962-8552703LX is cataloged in the U.S. Government catalog under NSN 5962-01-261-4044. This indicates validated use in U.S. government and defense supply chains.
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