5962-85155122B: MICROCIRCUIT,MEMORY.
The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.358 INCHES NOMINAL IN, body_height: 0.100 INCHES NOMINAL IN, body_length: 0.358 INCHES NOMINAL IN, features_provided: ELECTROSTATIC SENSITIVE AND BIPOLAR AND PROGRAMMABLE AND MONOLITHIC, output_logic_form: BIPOLAR METAL-OXIDE SEMICONDUCTOR, inclosure_material: CERAMIC. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-312-5397, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.358 INCHES NOMINAL IN |
| body_height | 0.100 INCHES NOMINAL IN |
| body_length | 0.358 INCHES NOMINAL IN |
| features_provided | ELECTROSTATIC SENSITIVE AND BIPOLAR AND PROGRAMMABLE AND MONOLITHIC |
| output_logic_form | BIPOLAR METAL-OXIDE SEMICONDUCTOR |
| inclosure_material | CERAMIC |
| memory_device_type | PAL |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | 16 INPUT |
| inclosure_configuration | DUAL-IN-LINE |
| terminal_surface_treatment | SOLDER |
| NSN | 5962-01-312-5397 |
| INPUT CIRCUIT PATTERN | 16 INPUT |
| INCLOSURE MATERIAL | CERAMIC |
| TERMINAL SURFACE TREATMENT | SOLDER |
| BODY WIDTH | 0.358 INCHES NOMINAL IN |
| BODY HEIGHT | 0.100 INCHES NOMINAL IN |
| FEATURES PROVIDED | ELECTROSTATIC SENSITIVE AND BIPOLAR AND PROGRAMMABLE AND MONOLITHIC |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CURRENT RATING PER CHARACTERISTIC | 12.00 MILLIAMPERES MAXIMUM OUTPUT |
| MEMORY DEVICE TYPE | PAL |
| CASE OUTLINE SOURCE AND DESIGNATOR | C-2 MIL-M-38510 |