5962-85155022A: MICROCIRCUIT,MEMORY.
The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.350 INCHES MAXIMUM IN, body_height: 0.100 INCHES MAXIMUM IN, body_length: 0.350 INCHES MAXIMUM IN, features_provided: PROGRAMMED AND BIPOLAR, output_logic_form: BIPOLAR METAL-OXIDE SEMICONDUCTOR, inclosure_material: CERAMIC. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-262-2712, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.350 INCHES MAXIMUM IN |
| body_height | 0.100 INCHES MAXIMUM IN |
| body_length | 0.350 INCHES MAXIMUM IN |
| features_provided | PROGRAMMED AND BIPOLAR |
| output_logic_form | BIPOLAR METAL-OXIDE SEMICONDUCTOR |
| inclosure_material | CERAMIC |
| memory_device_type | PAL |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | 16 INPUT |
| hybrid_technology_type | MONOLITHIC |
| inclosure_configuration | LEADLESS FLAT PACK |
| NSN | 5962-01-262-2712 |
| INPUT CIRCUIT PATTERN | 16 INPUT |
| INCLOSURE MATERIAL | METAL OR PLASTIC OR CERAMIC |
| TERMINAL SURFACE TREATMENT | SOLDER |
| BODY WIDTH | 0.350 INCHES MAXIMUM IN |
| BODY HEIGHT | 0.100 INCHES MAXIMUM IN |
| FEATURES PROVIDED | MONOLITHIC AND BIPOLAR AND PROGRAMMABLE |
| INCLOSURE CONFIGURATION | LEADED CHIP CARRIER |
| CURRENT RATING PER CHARACTERISTIC | 12.00 MILLIAMPERES MAXIMUM OUTPUT |
| MEMORY DEVICE TYPE | PAL |
| CASE OUTLINE SOURCE AND DESIGNATOR | C-2 MIL-M-38510 |