The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 11.23 MILLIMETERS MINIMUM AND 11.68 MILLIMETERS MAXIMUM MM, body_height: 1.52 MILLIMETERS MINIMUM AND 2.54 MILLIMETERS MAXIMUM MM, body_length: 11.23 MILLIMETERS MINIMUM MM, features_provided: ELECTROSTATIC SENSITIVE, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-176-3707, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 11.23 MILLIMETERS MINIMUM AND 11.68 MILLIMETERS MAXIMUM MM |
| body_height | 1.52 MILLIMETERS MINIMUM AND 2.54 MILLIMETERS MAXIMUM MM |
| body_length | 11.23 MILLIMETERS MINIMUM MM |
| features_provided | ELECTROSTATIC SENSITIVE |
| output_logic_form | TRANSISTOR-TRANSISTOR LOGIC |
| inclosure_material | CERAMIC |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| test_data_document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | 10 INPUT |
| end_item_identification | MULTIPLE LAUNCH ROCKET SYSTEM (MLRS) |
| inclosure_configuration | LEADLESS FLAT PACK |
| NSN | 5962-01-176-3707 |
| FEATURES PROVIDED | BIPOLAR |
| BODY LENGTH | 1.410 INCHES NOMINAL IN |
| OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS DEGC |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| BODY HEIGHT | 0.145 INCHES NOMINAL IN |
| DESIGN FUNCTION AND QUANTITY | 1 CONVERTER, ANALOG TO DIGITAL |
| BODY WIDTH | 0.590 INCHES NOMINAL IN |