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Technical Data Sheet
PartsTable / COMPONENT / 5962-8200801BLA
5962-8200801BLA ✓ Verified by PartsTable
— · COMPONENT
WHAT YOU NEED TO KNOW
Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel
Confirm exact part number — similar PNs may be different parts
PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN, body_height: 0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN, body_length: 1.280 INCHES MAXIMUM IN, memory_capacity: UNKNOWN, features_provided: HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND BIPOLAR AND MONOLITHIC, output_logic_form: BIPOLAR METAL-OXIDE SEMICONDUCTOR. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-286-1614, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
5962-8200801BLA
NSN: 5962-01-286-1614
FSC: 5962
CAGE: 67268 — DLA LAND AND MARITIME DBA ENGINEERING AND TECHNICAL SUPPORT DIV DOCUMENT STANDARDIZATION DIVISION (STANDARD MICROCIRCUIT (USA)
SPECIFICATIONS
body_width0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
body_height0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN
body_length1.280 INCHES MAXIMUM IN
memory_capacityUNKNOWN
features_providedHERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND BIPOLAR AND MONOLITHIC
output_logic_formBIPOLAR METAL-OXIDE SEMICONDUCTOR
inclosure_materialCERAMIC
memory_device_typeROM
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
test_data_document96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern14 INPUT
NSN5962-01-286-1614
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN 5962-8200801BLA MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
OPERATING TEMP RANGE: -55.0 TO 125.0 CELSIUS DEGC
•
INCLOSURE MATERIAL: CERAMIC
•
FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND BIPOLAR AND MONOLITHIC
•
CURRENT RATING PER CHARACTERISTIC: 100.00 MILLIAMPERES NOMINAL OUTPUT
•
TERMINAL TYPE AND QUANTITY: 24 PRINTED CIRCUIT
•
MEMORY CAPACITY: UNKNOWN
•
TEST DATA DOCUMENT: 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
•
TIME RATING PER CHACTERISTIC: 95.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 95.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS (FLIS)
OPERATING TEMP RANGE-55.0 TO 125.0 CELSIUS DEGC
INCLOSURE MATERIALCERAMIC
FEATURES PROVIDEDHERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND BIPOLAR AND MONOLITHIC
CURRENT RATING PER CHARACTERISTIC100.00 MILLIAMPERES NOMINAL OUTPUT
TERMINAL TYPE AND QUANTITY24 PRINTED CIRCUIT
MEMORY CAPACITYUNKNOWN
TEST DATA DOCUMENT96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
TIME RATING PER CHACTERISTIC95.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 95.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS
TERMINAL SURFACE TREATMENTSOLDER
MEMORY DEVICE TYPEROM
VERIFIED SUBSTITUTES & CROSS-REFERENCES 27
B18.2.1Interchangeable
interchangeable cross-reference
interchangeable
MS35355-67Interchangeable
interchangeable cross-reference
interchangeable
426927Interchangeable
interchangeable cross-reference
interchangeable
82008Interchangeable
interchangeable cross-reference
interchangeable
2140130Interchangeable
interchangeable cross-reference
interchangeable
667770Interchangeable
interchangeable cross-reference
interchangeable
LIFECYCLE
StatusACTIVE
AvailabilityOEM and secondary market
RoHS CompliantEAR99ESD SensitiveNot HAZMAT
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FREQUENTLY ASKED QUESTIONS
What is 5962-8200801BLA?
5962-8200801BLA is a MICROCIRCUIT,MEMORY.
What parts can replace 5962-8200801BLA?
There are 27 known substitutes for 5962-8200801BLA: B18.2.1, MS35355-67, 426927 and 24 more. Substitute compatibility should be verified for your specific system.
What is the NSN for 5962-8200801BLA?
5962-8200801BLA is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-286-1614. This indicates validated use in U.S. government and defense supply chains.
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Last verified: July 2026