5962-8160001HXB: MICROCIRCUIT,HYBRID.
The MICROCIRCUIT,HYBRID is a the manufacturer industrial component. Key specifications include body_width: 5.6 MILLIMETERS MINIMUM AND 7.9 MILLIMETERS MAXIMUM MM, body_height: 3.6 MILLIMETERS MAXIMUM MM, body_length: 10.3 MILLIMETERS MAXIMUM MM, inclosure_material: CERAMIC, storage_temp_range: -65.0 TO 150.0 CELSIUS DEGC, operating_temp_range: -55.0 TO 125.0 CELSIUS DEGC. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-413-4324, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 5.6 MILLIMETERS MINIMUM AND 7.9 MILLIMETERS MAXIMUM MM |
| body_height | 3.6 MILLIMETERS MAXIMUM MM |
| body_length | 10.3 MILLIMETERS MAXIMUM MM |
| inclosure_material | CERAMIC |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| hybrid_technology_type | MONOLITHIC |
| inclosure_configuration | DUAL-IN-LINE |
| terminal_surface_treatment | SOLDER |
| design_function_and_quantity | 1 CONVERTER, DC |
| current_rating_per_characteristic | 16.00 MILLIAMPERES NOMINAL SUPPLY |
| voltage_rating_and_type_per_characteristic | 16.0 VOLTS MINIMUM APPLIED AND 40.0 VOLTS MAXIMUM APPLIED |
| NSN | 5962-01-413-4324 |
| HYBRID TECHNOLOGY TYPE | MONOLITHIC |
| INCLOSURE MATERIAL | CERAMIC |
| TERMINAL SURFACE TREATMENT | SOLDER |
| DESIGN FUNCTION AND QUANTITY | 1 CONVERTER, DC |
| BODY WIDTH | 5.6 MILLIMETERS MINIMUM AND 7.9 MILLIMETERS MAXIMUM MM |
| BODY HEIGHT | 3.6 MILLIMETERS MAXIMUM MM |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CURRENT RATING PER CHARACTERISTIC | 16.00 MILLIAMPERES NOMINAL SUPPLY |
| BODY LENGTH | 10.3 MILLIMETERS MAXIMUM MM |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS DEGC |