5962-3836001B2A — Technical Data Sheet

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— · COMPONENT

WHAT YOU NEED TO KNOW

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PRODUCT OVERVIEW

The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM IN, body_height: 0.060 INCHES MINIMUM AND 0.100 INCHES MAXIMUM IN, body_length: 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM IN, features_provided: LOW POWER AND MONOLITHIC AND SCHOTTKY AND W/DISABLE AND W/ENABLE, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the Federal Logistics Information System under NSN 5962-01-321-8458, indicating validated use in U.S.

government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels. Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

5962-3836001B2A

NSN: 5962-01-321-8458
FSC: 5962
CAGE: 81349 — MILITARY SPECIFICATIONS PROMULGATED BY MILITARY DEPARTMENTS/AGENCIES UNDER AUTHORITY OF DEFENSE STANDARDIZATION MANUAL 4120 3-M

SPECIFICATIONS

body_width	0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM IN
body_height	0.060 INCHES MINIMUM AND 0.100 INCHES MAXIMUM IN
body_length	0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM IN
features_provided	LOW POWER AND MONOLITHIC AND SCHOTTKY AND W/DISABLE AND W/ENABLE
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	9 INPUT
inclosure_configuration	LEADLESS FLAT PACK
terminal_surface_treatment	SOLDER
terminal_type_and_quantity	20 LEADLESS
NSN	5962-01-321-8458

COMPONENT DIAGRAM

KEY FEATURES

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INPUT CIRCUIT PATTERN: 9 INPUT

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INCLOSURE CONFIGURATION: LEADLESS FLAT PACK

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SPECIFICATION/STANDARD DATA: 81349-MIL-M-38510/360 GOVERNMENT SPECIFICATION

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OPERATING TEMP RANGE: -55.0 TO 125.0 CELSIUS DEGC

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FEATURES PROVIDED: LOW POWER AND MONOLITHIC AND SCHOTTKY AND W/DISABLE AND W/ENABLE

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TERMINAL SURFACE TREATMENT: SOLDER

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MAXIMUM POWER DISSIPATION RATING: 110.0 MILLIWATTS

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OUTPUT LOGIC FORM: TRANSISTOR-TRANSISTOR LOGIC

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	9 INPUT
INCLOSURE CONFIGURATION	LEADLESS FLAT PACK
SPECIFICATION/STANDARD DATA	81349-MIL-M-38510/360 GOVERNMENT SPECIFICATION
OPERATING TEMP RANGE	-55.0 TO 125.0 CELSIUS DEGC
FEATURES PROVIDED	LOW POWER AND MONOLITHIC AND SCHOTTKY AND W/DISABLE AND W/ENABLE
TERMINAL SURFACE TREATMENT	SOLDER
MAXIMUM POWER DISSIPATION RATING	110.0 MILLIWATTS
OUTPUT LOGIC FORM	TRANSISTOR-TRANSISTOR LOGIC
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC
VOLTAGE RATING AND TYPE PER CHARACTERISTIC	7.0 VOLTS MAXIMUM POWER SOURCE

VERIFIED SUBSTITUTES & CROSS-REFERENCES 28

230742InterchangeableGOVERNMENT REGISTRY