The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN, body_height: 0.030 INCHES MINIMUM AND 0.085 INCHES MAXIMUM IN, body_length: 0.280 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, precious_material: GOLD. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-00-001-3000, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN |
| body_height | 0.030 INCHES MINIMUM AND 0.085 INCHES MAXIMUM IN |
| body_length | 0.280 INCHES MAXIMUM IN |
| features_provided | HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS |
| output_logic_form | TRANSISTOR-TRANSISTOR LOGIC |
| precious_material | GOLD |
| inclosure_material | CERAMIC AND GLASS |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | 4 WIDE 2 INPUT |
| inclosure_configuration | FLAT PACK |
| terminal_surface_treatment | GOLD |
| NSN | 5962-00-001-3000 |
| BODY LENGTH | 0.280 INCHES MAXIMUM IN |
| INCLOSURE CONFIGURATION | FLAT PACK |
| INCLOSURE MATERIAL | CERAMIC AND GLASS |
| PRECIOUS MATERIAL AND LOCATION | TERMINALS GOLD |
| SPECIFICATION/STANDARD DATA | 81349-MIL-M-38510/5 GOVERNMENT SPECIFICATION |
| CASE OUTLINE SOURCE AND DESIGNATOR | F-1 MIL-M-38510 |
| BODY WIDTH | 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN |
| INPUT CIRCUIT PATTERN | 4 WIDE 2 INPUT |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS DEGC |
| MAXIMUM POWER DISSIPATION RATING | 340.0 MILLIWATTS |