The Microcircuit,memory, cataloged under National Stock Number 5962-01-725-4571, is classified within Federal Supply Class 5962 (Microcircuits, Electronic) of the Electrical and Electronic Equipment Components group. The manufacturer of record is Xilinx Inc. Dba Xilinx Inc. Government technical data includes 8 specifications, cited from the U.S. Government catalog. The record lists 2 manufacturer part numbers for this item, enabling identification through both NSN and commercial part number lookups. 1 additional reference document (drawings, advisory and superseded references) is recorded in the U.S. Government catalog. Current acquisition status: Active.
| Parameter | Value |
|---|---|
| NSN | 5962-01-725-4571 |
| Primary Part Number | XCF128XFTG64C |
| Item Name | Microcircuit,memory |
| FSC / FSG | 5962 / 59 — Microcircuits, Electronic |
| Manufacturer | Xilinx Inc. Dba Xilinx Inc |
| Status | ACTIVE |
| Features Provided | ERASABLE AND SYNCHRONOUS |
| Inclosure Configuration | BALL GRID ARRAY |
| Memory Device Type | PROGRAMMABLE |
| Storage Temp Range | -65.0 TO 125.0 CELSIUS DEGC |
| Output Logic Form | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| Voltage Rating and Type Per Characteristic | 1.7 VOLTS MINIMUM TOTAL SUPPLY AND 2.0 VOLTS MAXIMUM TOTAL SUPPLY |
| Operating Temp Range | -40.0 TO 85.0 CELSIUS DEGC |
| Terminal Type and Quantity | 64 BALL |
| Acquisition Status | ACTIVE |
| DEMIL Code | DEMIL A — No Demilitarization Required |
| Hazard | No hazard code in the DLA record (HMIC N) |
| Criticality Code | X |
| Part Number | Manufacturer |
|---|---|
| XCF128XFTG64C PRIMARY | Xilinx Inc. Dba Xilinx Inc (USA) |
| 26201476 | Bae Systems Integrated System Technologies Ltd (GBR) |
| Reference | Meaning |
|---|---|
| 10499719 | 6/9 Informative reference only Nimikkeistokeskus Ncb Finland |
NSN 5962-01-725-4571 is a Microcircuit,memory, manufactured by Xilinx Inc. Dba Xilinx Inc, classified under FSC 5962, Microcircuits, Electronic. Status: active.
NSN 5962-01-725-4571 has 2 manufacturer part numbers on file: XCF128XFTG64C (Xilinx Inc. Dba Xilinx Inc), 26201476 (Bae Systems Integrated System Technologies Ltd).
Key specifications for XCF128XFTG64C: Features Provided: ERASABLE AND SYNCHRONOUS; Inclosure Configuration: BALL GRID ARRAY; Memory Device Type: PROGRAMMABLE; Storage Temp Range: -65.0 TO 125.0 CELSIUS DEGC. 8 specifications are documented in the U.S. Government catalog.
No hazard code in the DLA record (HMIC N). Hazard information on this page is shown exactly as it appears in the DLA record.
U.S. Government catalog: edition PUBLOGDVD v12.0.0 (OCT 2026), edition date 2026-10-01, retrieved 2026-10-16.
U.S. Government catalog: edition PUBLOGDVD v12.0.0 (OCT 2026), edition date 2026-10-01, retrieved 2026-10-18.