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NSN 5962-01-685-7667Government record, cited

Microcircuit, Memory5962-01-685-7667

NSN 5962-01-685-7667 · NIIN 016857667 · Part number 876099-B21
Hewlett-Packard Company Dba HP · FSC 5962 — Microcircuits, Electronic · FSG 59 — Electrical and Electronic Equipment Components · CAGE 28480
Government record, cited
NSN 5962-01-685-7667 — this item is cataloged by the U.S. Government under National Stock Number 5962-01-685-7667. Manufacturer of record part number: 876099-B21.
Also searched as  5962-01-685-7667 · 5962016857667 · NIIN 016857667 · 01-685-7667 · FSC 5962 Microcircuits, Electronic · CAGE 28480 · 876099-B21
Nearby stock numbers  ·
Features
  • Microcircuit,memory — FSC 5962
  • Inclosure Configuration: LEADLESS FLAT PACK
  • Memory Device Type: RAM
  • Operating Temp Range: -0.1 TO 85.0 CELSIUS DEGC
  • Terminal Type and Quantity: 0 LEADLESS
  • Memory Capacity: 1500
  • 2 manufacturer part numbers on file
  • Manufacturer of record: Hewlett-Packard Company Dba HP
Identification
  • NSN: 5962-01-685-7667
  • NIIN: 016857667
  • FSC: 5962 — Microcircuits, Electronic
  • FSG: 59 — Electrical and Electronic Equipment Components
  • Primary part number: 876099-B21
  • Manufacturer: Hewlett-Packard Company Dba HP
General Description

The Microcircuit,memory, cataloged under National Stock Number 5962-01-685-7667, is classified within Federal Supply Class 5962 (Microcircuits, Electronic) of the Electrical and Electronic Equipment Components group. The manufacturer of record is Hewlett-Packard Company Dba HP. Government technical data includes 5 specifications, cited from the U.S. Government catalog. The record lists 2 manufacturer part numbers for this item, enabling identification through both NSN and commercial part number lookups. Current acquisition status: Active.

Technical Specifications
ParameterValue
NSN5962-01-685-7667
Primary Part Number876099-B21
Item NameMicrocircuit,memory
FSC / FSG5962 / 59 — Microcircuits, Electronic
ManufacturerHewlett-Packard Company Dba HP
StatusACTIVE
Inclosure ConfigurationLEADLESS FLAT PACK
Memory Device TypeRAM
Operating Temp Range-0.1 TO 85.0 CELSIUS DEGC
Terminal Type and Quantity0 LEADLESS
Memory Capacity1500
Lifecycle & Compliance
Acquisition StatusACTIVE
DEMIL CodeDEMIL A — No Demilitarization Required
HazardNo hazard code in the DLA record (HMIC N)
Criticality CodeX
Cross-Reference Index
Part NumberManufacturer
876099-B21 Hewlett-Packard Ltd (GBR)
876099-B21 PRIMARY Hewlett-Packard Company Dba HP (USA)
No interchangeability data on file.
Other items in FSC 5962 — Microcircuits, Electronic
Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.
5962-00-001-1861
MICROCIRCUIT,DIGITAL
5962-00-001-1901
MICROCIRCUIT,LINEAR
5962-00-001-1902
MICROCIRCUIT,DIGITAL
5962-00-001-1905
MICROCIRCUIT,MEMORY
5962-00-001-1906
MICROCIRCUIT,DIGITAL
5962-00-001-1907
MICROCIRCUIT,DIGITAL
5962-00-001-1908
MICROCIRCUIT,DIGITAL
5962-00-001-1909
MICROCIRCUIT,DIGITAL

Frequently Asked Questions

What is NSN 5962-01-685-7667?

NSN 5962-01-685-7667 is a Microcircuit,memory, manufactured by Hewlett-Packard Company Dba HP, classified under FSC 5962, Microcircuits, Electronic. Status: active.

What part numbers are listed for NSN 5962-01-685-7667?

NSN 5962-01-685-7667 has 2 manufacturer part numbers on file: 876099-B21 (Hewlett-Packard Ltd), 876099-B21 (Hewlett-Packard Company Dba HP).

What are the specifications of 876099-B21?

Key specifications for 876099-B21: Inclosure Configuration: LEADLESS FLAT PACK; Memory Device Type: RAM; Operating Temp Range: -0.1 TO 85.0 CELSIUS DEGC; Terminal Type and Quantity: 0 LEADLESS. 5 specifications are documented in the U.S. Government catalog.

Is NSN 5962-01-685-7667 hazardous material?

No hazard code in the DLA record (HMIC N). Hazard information on this page is shown exactly as it appears in the DLA record.

Sources

U.S. Government catalog: edition PUBLOGDVD v12.0.0 (OCT 2026), edition date 2026-10-01, retrieved 2026-10-16.

U.S. Government catalog: edition PUBLOGDVD v12.0.0 (OCT 2026), edition date 2026-10-01, retrieved 2026-10-18.

✓ Data cited from the U.S. Government catalog; commercial cross-references from OEM and certified industry sources.
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