The Microcircuit,memory, cataloged under National Stock Number 5962-01-418-3471, is classified within Federal Supply Class 5962 (Microcircuits, Electronic) of the Electrical and Electronic Equipment Components group. Government technical data includes 8 specifications, cited from the U.S. Government catalog. 5 additional reference documents (drawings, advisory and superseded references) are recorded in the U.S. Government catalog. 7 items share a part number with this NSN in the catalog (possible match — not a government interchangeability claim). Current acquisition status: Active.
| Parameter | Value |
|---|---|
| NSN | 5962-01-418-3471 |
| Item Name | Microcircuit,memory |
| FSC / FSG | 5962 / 59 — Microcircuits, Electronic |
| Status | ACTIVE |
| Inclosure Material | CERAMIC |
| Terminal Surface Treatment | SOLDER |
| Inclosure Configuration | LEADLESS FLAT PACK |
| Memory Device Type | ROM |
| Voltage Rating and Type Per Characteristic | 5.5 VOLTS NOMINAL POWER SOURCE |
| Operating Temp Range | -55.0 TO 125.0 CELSIUS DEGC |
| Terminal Type and Quantity | 32 LEADLESS |
| Time Rating Per Chacteristic | 55.00 NANOSECONDS MAXIMUM ACCESS NS |
| Acquisition Status | ACTIVE |
| DEMIL Code | DEMIL D — Destroy Item |
| Hazard | No hazard code in the DLA record (HMIC N) |
| Criticality Code | X |
| Reference | Meaning |
|---|---|
| 7503563G0013 | 3/9 Design control — primary reference U.S. Government activity |
| ROM/PROM | 5/1 Secondary reference Dla Land and Maritime Dba Engineering and Technical Support Div Document Standardization Division (vendor Item Drawings) |
| 7555495P551 | 5/1 Secondary reference U.S. Government activity |
| 7503563G13 | 5/9 Secondary reference U.S. Government activity |
| CY7C251-55LMB | 5/1 Secondary reference Infineon Technologies Americas Corp. |
NSN 5962-01-418-3471 is a Microcircuit,memory, classified under FSC 5962, Microcircuits, Electronic. Status: active.
7 possible matches (shared part number, not a government interchangeability claim): 5962-01-418-3472, 5962-01-418-3496, 5962-01-418-3497. Verify interchangeability with system specifications before substitution.
Key specifications for 5962-01-418-3471: Inclosure Material: CERAMIC; Terminal Surface Treatment: SOLDER; Inclosure Configuration: LEADLESS FLAT PACK; Memory Device Type: ROM. 8 specifications are documented in the U.S. Government catalog.
No hazard code in the DLA record (HMIC N). Hazard information on this page is shown exactly as it appears in the DLA record.
NSN 5962-01-418-3471 has DEMIL Code D. Demilitarization may be required before disposal or transfer to non-military entities.
U.S. Government catalog: edition PUBLOGDVD v12.0.0 (OCT 2026), edition date 2026-10-01, retrieved 2026-10-16.
U.S. Government catalog: edition PUBLOGDVD v12.0.0 (OCT 2026), edition date 2026-10-01, retrieved 2026-10-18.