The Microcircuit,memory, cataloged under National Stock Number 5962-01-357-1833, is classified within Federal Supply Class 5962 (No Item Name Available) of the Electrical and Electronic Equipment Components group. The primary manufacturer of record is Hamilton Sundstrand Corporation Dba Collins Aerospace. Government technical data includes 20 verified specifications, sourced from the Federal Logistics Information System (FLIS). This item has 3 commercial cross-references from 2 manufacturers, enabling identification through both NSN and commercial part number lookups. 4 verified substitutes exist in the FLIS interchangeability database. Current acquisition status: Active.
| Parameter | Value |
|---|---|
| NSN | 5962-01-357-1833 |
| Primary Part Number | 795440-1-016 |
| Item Name | Microcircuit,memory |
| FSC / FSG | 5962 / 59 — No Item Name Available |
| Manufacturer | Hamilton Sundstrand Corporation Dba Collins Aerospace |
| Status | ACTIVE |
| Inclosure Material | CERAMIC |
| Output Logic Form | N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
| Case Outline Source and Designator | D-10 MIL-M-38510 |
| Terminal Type and Quantity | 28 PRINTED CIRCUIT |
| Memory Device Type | EPROM |
| Current Rating Per Characteristic | 140.00 MILLIAMPERES MAXIMUM SUPPLY |
| Capitance Rating Per Characteristic | 7.00 INPUT PICOFARADS MAXIMUM AND 12.00 OUTPUT PICOFARADS MAXIMUM |
| Terminal Surface Treatment | SOLDER |
| Voltage Rating and Type Per Characteristic | 5.5 VOLTS MAXIMUM POWER SOURCE |
| Time Rating Per Chacteristic | 250.00 NANOSECONDS MAXIMUM ACCESS NS |
| Test Data Document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| Inclosure Configuration | DUAL-IN-LINE |
| Maximum Power Dissipation Rating | 825.0 MILLIWATTS |
| Body Width | 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN |
| Operating Temp Range | -55.0 TO 125.0 CELSIUS DEGC |
| Features Provided | HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND ULTRAVIOLET ERASABLE AND ELECTROSTATIC SENSITIVE |
| Body Length | 1.490 INCHES MAXIMUM IN |
| Input Circuit Pattern | 18 INPUT |
| Storage Temp Range | -65.0 TO 150.0 CELSIUS DEGC |
| Body Height | 0.217 INCHES MAXIMUM IN |
| Acquisition Status | ACTIVE |
| HAZMAT | No |
| Part Number | Manufacturer |
|---|---|
| ROM/PROM | Dla Land and Maritime Dba Engineering and Technical Support Div Document Standardization Division (vendor Item Drawings) (USA) |
| 795440-1-016 PRIMARY | Hamilton Sundstrand Corporation Dba Collins Aerospace (USA) |
| 795440-1 | Hamilton Sundstrand Corporation Dba Collins Aerospace (USA) |
NSN 5962-01-357-1833 is a Microcircuit,memory, manufactured by Hamilton Sundstrand Corporation Dba Collins Aerospace, classified under FSC 5962 (No Item Name Available). Status: active.
NSN 5962-01-357-1833 has 3 cross-referenced part numbers: ROM/PROM (Dla Land and Maritime Dba Engineering and Technical Support Div Document Standardization Division (vendor Item Drawings)), 795440-1-016 (Hamilton Sundstrand Corporation Dba Collins Aerospace), 795440-1 (Hamilton Sundstrand Corporation Dba Collins Aerospace).
There are 4 known substitutes for 5962-01-357-1833: 2520-00-692-5216, 5998-01-039-5427, 5962-01-347-4233 and 1 more. Verify interchangeability with system specifications before substitution.
Key specifications for 795440-1-016: Inclosure Material: CERAMIC; Output Logic Form: N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC; Case Outline Source and Designator: D-10 MIL-M-38510; Terminal Type and Quantity: 28 PRINTED CIRCUIT. 20 total characteristics are documented in the Federal Logistics Information System.