The Microcircuit,memory, cataloged under National Stock Number 5962-01-330-7858, is classified within Federal Supply Class 5962 (Microcircuits, Electronic) of the Electrical and Electronic Equipment Components group. The manufacturer of record is Xicor Inc. Government technical data includes 16 specifications, cited from the U.S. Government catalog. The record lists 2 manufacturer part numbers for this item, enabling identification through both NSN and commercial part number lookups. 1 additional reference document (drawings, advisory and superseded references) is recorded in the U.S. Government catalog. Current acquisition status: Active.
| Parameter | Value |
|---|---|
| NSN | 5962-01-330-7858 |
| Primary Part Number | X2444DMB |
| Item Name | Microcircuit,memory |
| FSC / FSG | 5962 / 59 — Microcircuits, Electronic |
| Manufacturer | Xicor Inc |
| Status | ACTIVE |
| Input Circuit Pattern | 5 INPUT |
| Inclosure Material | CERAMIC |
| Terminal Surface Treatment | SOLDER |
| Body Width | 0.282 INCHES MINIMUM AND 0.288 INCHES MAXIMUM IN |
| Body Height | 0.140 INCHES MINIMUM AND 0.165 INCHES MAXIMUM IN |
| Features Provided | HERMETICALLY SEALED AND BURN IN AND W/ENABLE AND W/CLOCK |
| Inclosure Configuration | DUAL-IN-LINE |
| Memory Device Type | ROM |
| Body Length | 0.387 INCHES MINIMUM AND 0.393 INCHES MAXIMUM IN |
| Storage Temp Range | -65.0 TO 150.0 CELSIUS DEGC |
| Output Logic Form | N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
| Voltage Rating and Type Per Characteristic | 6.0 VOLTS MAXIMUM POWER SOURCE |
| Operating Temp Range | -55.0 TO 125.0 CELSIUS DEGC |
| Test Data Document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| Terminal Type and Quantity | 8 PRINTED CIRCUIT |
| Memory Capacity | UNKNOWN |
| Acquisition Status | ACTIVE |
| DEMIL Code | DEMIL Q — CCL Item — Commerce Control List |
| Hazard | No hazard code in the DLA record (HMIC N) |
| Criticality Code | X |
| Part Number | Manufacturer |
|---|---|
| GF00001388 | Bae Systems (GBR) |
| X2444DMB PRIMARY | Xicor Inc (USA) |
| Reference | Meaning |
|---|---|
| 351-5731-030 | C/1 Advisory reference — outside the item-of-supply concept Rockwell Collins, Inc. Dba Collins Aerospace Government Systems Div Collins Aerospace - Government Systems |
NSN 5962-01-330-7858 is a Microcircuit,memory, manufactured by Xicor Inc, classified under FSC 5962, Microcircuits, Electronic. Status: active.
NSN 5962-01-330-7858 has 2 manufacturer part numbers on file: GF00001388 (Bae Systems), X2444DMB (Xicor Inc).
Key specifications for X2444DMB: Input Circuit Pattern: 5 INPUT; Inclosure Material: CERAMIC; Terminal Surface Treatment: SOLDER; Body Width: 0.282 INCHES MINIMUM AND 0.288 INCHES MAXIMUM IN. 16 specifications are documented in the U.S. Government catalog.
No hazard code in the DLA record (HMIC N). Hazard information on this page is shown exactly as it appears in the DLA record.
NSN 5962-01-330-7858 has DEMIL Code Q. Demilitarization may be required before disposal or transfer to non-military entities.
U.S. Government catalog: edition PUBLOGDVD v12.0.0 (OCT 2026), edition date 2026-10-01, retrieved 2026-10-16.
U.S. Government catalog: edition PUBLOGDVD v12.0.0 (OCT 2026), edition date 2026-10-01, retrieved 2026-10-18.