The Microcircuit,memory, cataloged under National Stock Number 5962-01-305-5363, is classified within Federal Supply Class 5962 (No Item Name Available) of the Electrical and Electronic Equipment Components group. The primary manufacturer of record is Northrop Grumman Defense Mission Systems, Inc.. Government technical data includes 19 verified specifications, sourced from the Federal Logistics Information System (FLIS). This item has 4 commercial cross-references from 3 manufacturers, enabling identification through both NSN and commercial part number lookups. 12 verified substitutes exist in the FLIS interchangeability database. Current acquisition status: Active.
| Parameter | Value |
|---|---|
| NSN | 5962-01-305-5363 |
| Primary Part Number | 100-AD239/139-5N |
| Item Name | Microcircuit,memory |
| FSC / FSG | 5962 / 59 — No Item Name Available |
| Manufacturer | Northrop Grumman Defense Mission Systems, Inc. |
| Status | ACTIVE |
| Inclosure Configuration | DUAL-IN-LINE |
| Maximum Power Dissipation Rating | 1.0 WATTS |
| Terminal Surface Treatment | SOLDER |
| Memory Device Type | ROM |
| Memory Capacity | UNKNOWN |
| Test Data Document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| Voltage Rating and Type Per Characteristic | 6.5 VOLTS MAXIMUM POWER SOURCE |
| Terminal Type and Quantity | 28 PRINTED CIRCUIT |
| Case Outline Source and Designator | D-10 MIL-M-38510 |
| Time Rating Per Chacteristic | 250.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 250.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS |
| Body Width | 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN |
| Body Height | 0.172 INCHES MINIMUM AND 0.217 INCHES MAXIMUM IN |
| Input Circuit Pattern | 17 INPUT |
| Output Logic Form | N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
| Operating Temp Range | -55.0 TO 125.0 CELSIUS DEGC |
| Storage Temp Range | -65.0 TO 150.0 CELSIUS DEGC |
| Inclosure Material | CERAMIC |
| Features Provided | HERMETICALLY SEALED AND BURN IN AND ULTRAVIOLET ERASABLE AND PROGRAMMABLE AND W/ENABLE |
| Body Length | 1.490 INCHES MAXIMUM IN |
| Acquisition Status | ACTIVE |
| HAZMAT | No |
| Part Number | Manufacturer |
|---|---|
| 8411102YA | Dla Land and Maritime Dba Engineering and Technical Support Div Document Standardization Division (standard Microcircuit (USA) |
| ROM/PROM FAMILY 247 | Dla Land and Maritime Dba Engineering and Technical Support Div Document Standardization Division (vendor Item Drawings) (USA) |
| 100-AD239/139-5N PRIMARY | Northrop Grumman Defense Mission Systems, Inc. (USA) |
| 100-DL212 | Northrop Grumman Defense Mission Systems, Inc. (USA) |
NSN 5962-01-305-5363 is a Microcircuit,memory, manufactured by Northrop Grumman Defense Mission Systems, Inc., classified under FSC 5962 (No Item Name Available). Status: active.
NSN 5962-01-305-5363 has 4 cross-referenced part numbers: 8411102YA (Dla Land and Maritime Dba Engineering and Technical Support Div Document Standardization Division (standard Microcircuit), ROM/PROM FAMILY 247 (Dla Land and Maritime Dba Engineering and Technical Support Div Document Standardization Division (vendor Item Drawings)), 100-AD239/139-5N (Northrop Grumman Defense Mission Systems, Inc.), 100-DL212 (Northrop Grumman Defense Mission Systems, Inc.).
There are 12 known substitutes for 5962-01-305-5363: 5962-01-204-7268, 5962-01-290-6593, 5962-01-302-4369 and 9 more. Verify interchangeability with system specifications before substitution.
Key specifications for 100-AD239/139-5N: Inclosure Configuration: DUAL-IN-LINE; Maximum Power Dissipation Rating: 1.0 WATTS; Terminal Surface Treatment: SOLDER; Memory Device Type: ROM. 19 total characteristics are documented in the Federal Logistics Information System.