The Microcircuit,memory, cataloged under National Stock Number 5962-01-277-3049, is classified within Federal Supply Class 5962 (No Item Name Available) of the Electrical and Electronic Equipment Components group. The primary manufacturer of record is Lockheed Martin Corp Dba Lockheed Martin Div Mst - Eagan. Government technical data includes 17 verified specifications, sourced from the Federal Logistics Information System (FLIS). This item has 3 commercial cross-references from 2 manufacturers, enabling identification through both NSN and commercial part number lookups. 2 verified substitutes exist in the FLIS interchangeability database. Current acquisition status: Active.
| Parameter | Value |
|---|---|
| NSN | 5962-01-277-3049 |
| Primary Part Number | 7143065-02 |
| Item Name | Microcircuit,memory |
| FSC / FSG | 5962 / 59 — No Item Name Available |
| Manufacturer | Lockheed Martin Corp Dba Lockheed Martin Div Mst - Eagan |
| Status | ACTIVE |
| Test Data Document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| Memory Device Type | ROM |
| Terminal Type and Quantity | 16 PRINTED CIRCUIT |
| Memory Capacity | UNKNOWN |
| Time Rating Per Chacteristic | 30.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 30.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS |
| Voltage Rating and Type Per Characteristic | 7.0 VOLTS MAXIMUM POWER SOURCE |
| Terminal Surface Treatment | SOLDER |
| Operating Temp Range | -55.0 TO 125.0 CELSIUS DEGC |
| Body Width | 0.265 INCHES MINIMUM AND 0.300 INCHES MAXIMUM IN |
| Inclosure Material | CERAMIC |
| Input Circuit Pattern | 10 INPUT |
| Features Provided | HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND W/ENABLE AND MONOLITHIC |
| Body Length | 0.755 INCHES MINIMUM AND 0.790 INCHES MAXIMUM IN |
| Body Height | 0.155 INCHES MINIMUM AND 0.175 INCHES MAXIMUM IN |
| Storage Temp Range | -85.0 TO 150.0 CELSIUS DEGC |
| Output Logic Form | TRANSISTOR-TRANSISTOR LOGIC |
| Inclosure Configuration | DUAL-IN-LINE |
| Acquisition Status | ACTIVE |
| HAZMAT | No |
| Part Number | Manufacturer |
|---|---|
| ROM/PROM FAMILY 025 | Dla Land and Maritime Dba Engineering and Technical Support Div Document Standardization Division (vendor Item Drawings) (USA) |
| 7143065-02 PRIMARY | Lockheed Martin Corp Dba Lockheed Martin Div Mst - Eagan (USA) |
| 7904153-05 | Lockheed Martin Corp Dba Lockheed Martin Div Mst - Eagan (USA) |
NSN 5962-01-277-3049 is a Microcircuit,memory, manufactured by Lockheed Martin Corp Dba Lockheed Martin Div Mst - Eagan, classified under FSC 5962 (No Item Name Available). Status: active.
NSN 5962-01-277-3049 has 3 cross-referenced part numbers: ROM/PROM FAMILY 025 (Dla Land and Maritime Dba Engineering and Technical Support Div Document Standardization Division (vendor Item Drawings)), 7143065-02 (Lockheed Martin Corp Dba Lockheed Martin Div Mst - Eagan), 7904153-05 (Lockheed Martin Corp Dba Lockheed Martin Div Mst - Eagan).
There are 2 known substitutes for 5962-01-277-3049: 5962-01-071-5173, 5962-01-124-4295. Verify interchangeability with system specifications before substitution.
Key specifications for 7143065-02: Test Data Document: 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).; Memory Device Type: ROM; Terminal Type and Quantity: 16 PRINTED CIRCUIT; Memory Capacity: UNKNOWN. 18 total characteristics are documented in the Federal Logistics Information System.