The Microcircuit,memory, cataloged under National Stock Number 5962-01-260-3013, is classified within Federal Supply Class 5962 (No Item Name Available) of the Electrical and Electronic Equipment Components group. The primary manufacturer of record is Advanced Micro Devices Inc Dba AMD Austin. Government technical data includes 18 verified specifications, sourced from the Federal Logistics Information System (FLIS). This item has 18 commercial cross-references from 11 manufacturers, enabling identification through both NSN and commercial part number lookups. 12 verified substitutes exist in the FLIS interchangeability database. Current acquisition status: Active.
| Parameter | Value |
|---|---|
| NSN | 5962-01-260-3013 |
| Primary Part Number | AM27512-25DC |
| Item Name | Microcircuit,memory |
| FSC / FSG | 5962 / 59 — No Item Name Available |
| Manufacturer | Advanced Micro Devices Inc Dba AMD Austin |
| Status | ACTIVE |
| Body Width | 0.500 INCHES MAXIMUM IN |
| Storage Temp Range | -65.0 TO 150.0 CELSIUS DEGC |
| Inclosure Configuration | DUAL-IN-LINE |
| Memory Device Type | ROM |
| Voltage Rating and Type Per Characteristic | 0.6 VOLTS MAXIMUM POWER SOURCE |
| Terminal Type and Quantity | 28 PRINTED CIRCUIT |
| Current Rating Per Characteristic | 150.00 MILLIAMPERES MAXIMUM SUPPLY |
| Case Outline Source and Designator | D-10 MIL-M-38510 |
| Test Data Document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| Terminal Surface Treatment | TIN |
| Body Length | 1.375 INCHES MAXIMUM IN |
| Output Logic Form | TRANSISTOR-TRANSISTOR LOGIC |
| Inclosure Material | CERAMIC OR PLASTIC OR METAL |
| Body Height | 0.185 INCHES NOMINAL IN |
| Features Provided | MONOLITHIC AND ULTRAVIOLET ERASABLE AND PROGRAMMABLE |
| Operating Temp Range | -55.0 TO 125.0 CELSIUS DEGC |
| Input Circuit Pattern | 13 INPUT |
| Maximum Power Dissipation Rating | 825.0 MILLIWATTS |
| Acquisition Status | ACTIVE |
| HAZMAT | No |
| Part Number | Manufacturer |
|---|---|
| AM27512-25DC | Advanced Micro Devices Inc Dba AMD Austin (USA) |
| MD27512-25/B | Intel Corp Sales Office (USA) |
| AM27512-25/BXA | Advanced Micro Devices Inc Dba AMD Austin (USA) |
| 5962-8513501YX | Dla Land and Maritime Dba Engineering and Technical Support Div Document Standardization Division (standard Microcircuit (USA) |
| 8567761-1 | Lockheed Martin Corporation Dba Lockheed Martin Div Lockheed Martin (USA) |
| 5962-8513501YB | Dla Land and Maritime Dba Engineering and Technical Support Div Document Standardization Division (standard Microcircuit (USA) |
| 351-5171-012 | Rockwell Collins, Inc. Dba Collins Aerospace Government Systems Div Collins Aerospace - Government Systems (USA) |
| 5962PL0929675 | Jednolity Indeks Materialowy - Uniform Material Index (POL) |
| 5962-85135 | Dla Land and Maritime Dba Engineering and Technical Support Div Document Standardization Division (standard Microcircuit (USA) |
| ROM/PROM HEAD 144 | Dla Land and Maritime Dba Engineering and Technical Support Div Document Standardization Division (vendor Item Drawings) (USA) |
| 5962-8513501YA | Dla Land and Maritime Dba Engineering and Technical Support Div Document Standardization Division (standard Microcircuit (USA) |
| 5962-8513501YX | Dla Land and Maritime Dba Engineering and Technical Support Div Document Standardization Division (vendor Item Drawings) (USA) |
| D27C512-250V05 | Intel Corp Sales Office (USA) |
| TMS27C512-JL | Texas Instruments Incorporated (USA) |
| 7916791-00 | Lockheed Martin Corp Dba Lockheed Martin Div Mst - Eagan (USA) |
| 5962-8513501YX | Edo (USA) |
| 1:DM52B33H- | Seeq Technology Inc (USA) |
| 1:DM52B33H-250 | Seeq Technology Inc (USA) |
NSN 5962-01-260-3013 is a Microcircuit,memory, manufactured by Advanced Micro Devices Inc Dba AMD Austin, classified under FSC 5962 (No Item Name Available). Status: active.
NSN 5962-01-260-3013 has 18 cross-referenced part numbers: AM27512-25DC (Advanced Micro Devices Inc Dba AMD Austin), MD27512-25/B (Intel Corp Sales Office), AM27512-25/BXA (Advanced Micro Devices Inc Dba AMD Austin), 5962-8513501YX (Dla Land and Maritime Dba Engineering and Technical Support Div Document Standardization Division (standard Microcircuit), 8567761-1 (Lockheed Martin Corporation Dba Lockheed Martin Div Lockheed Martin) and 13 more.
There are 12 known substitutes for 5962-01-260-3013: 5962-01-260-3014, 5962-01-261-7884, 5962-01-298-0065 and 9 more. Verify interchangeability with system specifications before substitution.
Key specifications for AM27512-25DC: Body Width: 0.500 INCHES MAXIMUM IN; Storage Temp Range: -65.0 TO 150.0 CELSIUS DEGC; Inclosure Configuration: DUAL-IN-LINE; Memory Device Type: ROM. 18 total characteristics are documented in the Federal Logistics Information System.