The Microcircuit,memory, cataloged under National Stock Number 5962-01-249-8315, is classified within Federal Supply Class 5962 (No Item Name Available) of the Electrical and Electronic Equipment Components group. The primary manufacturer of record is Northrop Grumman Systems Corp Dba Northrop Grumman Systems Corp. Government technical data includes 17 verified specifications, sourced from the Federal Logistics Information System (FLIS). This item has 4 commercial cross-references from 4 manufacturers, enabling identification through both NSN and commercial part number lookups. 1 verified substitute exists in the FLIS interchangeability database. Current acquisition status: Active.
| Parameter | Value |
|---|---|
| NSN | 5962-01-249-8315 |
| Primary Part Number | 900657-2 |
| Item Name | Microcircuit,memory |
| FSC / FSG | 5962 / 59 — No Item Name Available |
| Manufacturer | Northrop Grumman Systems Corp Dba Northrop Grumman Systems Corp |
| Status | ACTIVE |
| Body Height | 0.170 INCHES MAXIMUM IN |
| Terminal Type and Quantity | 24 PRINTED CIRCUIT |
| Terminal Surface Treatment | SOLDER |
| Voltage Rating and Type Per Characteristic | 7.0 VOLTS MAXIMUM POWER SOURCE |
| Memory Device Type | ROM |
| Time Rating Per Chacteristic | 35.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 35.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS |
| Test Data Document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| Memory Capacity | UNKNOWN |
| Body Length | 1.235 INCHES MINIMUM AND 1.290 INCHES MAXIMUM IN |
| Features Provided | HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND BIPOLAR AND W/ENABLE AND 3-STATE OUTPUT |
| Operating Temp Range | -55.0 TO 125.0 CELSIUS DEGC |
| Output Logic Form | TRANSISTOR-TRANSISTOR LOGIC |
| Inclosure Configuration | DUAL-IN-LINE |
| Inclosure Material | CERAMIC |
| Input Circuit Pattern | 14 INPUT |
| Storage Temp Range | -65.0 TO 150.0 CELSIUS DEGC |
| Body Width | 0.620 INCHES MAXIMUM IN |
| Acquisition Status | ACTIVE |
| HAZMAT | No |
| Part Number | Manufacturer |
|---|---|
| AM27S43/BJA | Advanced Micro Devices Inc Dba AMD Austin (USA) |
| ROM/PROM | Dla Land and Maritime Dba Engineering and Technical Support Div Document Standardization Division (vendor Item Drawings) (USA) |
| 82S321F/883B | Philips Semiconductors Inc (USA) |
| 900657-2 PRIMARY | Northrop Grumman Systems Corp Dba Northrop Grumman Systems Corp (USA) |
NSN 5962-01-249-8315 is a Microcircuit,memory, manufactured by Northrop Grumman Systems Corp Dba Northrop Grumman Systems Corp, classified under FSC 5962 (No Item Name Available). Status: active.
NSN 5962-01-249-8315 has 4 cross-referenced part numbers: AM27S43/BJA (Advanced Micro Devices Inc Dba AMD Austin), ROM/PROM (Dla Land and Maritime Dba Engineering and Technical Support Div Document Standardization Division (vendor Item Drawings)), 82S321F/883B (Philips Semiconductors Inc), 900657-2 (Northrop Grumman Systems Corp Dba Northrop Grumman Systems Corp).
There is 1 known substitute for 5962-01-249-8315: 5962-01-196-6113. Verify interchangeability with system specifications before substitution.
Key specifications for 900657-2: Body Height: 0.170 INCHES MAXIMUM IN; End Item Identification: FACSIMILE SET AN/UXC-4; Terminal Type and Quantity: 24 PRINTED CIRCUIT; Terminal Surface Treatment: SOLDER. 18 total characteristics are documented in the Federal Logistics Information System.