The Microcircuit,memory, cataloged under National Stock Number 5962-01-234-6183, is classified within Federal Supply Class 5962 (No Item Name Available) of the Electrical and Electronic Equipment Components group. The primary manufacturer of record is Compaq Federal Llc. Government technical data includes 10 verified specifications, sourced from the Federal Logistics Information System (FLIS). This item has 2 commercial cross-references from 2 manufacturers, enabling identification through both NSN and commercial part number lookups. 12 verified substitutes exist in the FLIS interchangeability database. Current acquisition status: Cancelled.
| Parameter | Value |
|---|---|
| NSN | 5962-01-234-6183 |
| Primary Part Number | 23-160A2-00 |
| Item Name | Microcircuit,memory |
| FSC / FSG | 5962 / 59 — No Item Name Available |
| Manufacturer | Compaq Federal Llc |
| Status | CANCELLED |
| Inclosure Material | PLASTIC |
| Memory Device Type | PROM |
| Inclosure Configuration | DUAL-IN-LINE |
| Terminal Surface Treatment | SOLDER |
| Operating Temp Range | +0.0 TO 75.0 CELSIUS DEGC |
| Body Height | 0.115 INCHES MINIMUM AND 0.125 INCHES MAXIMUM IN |
| Output Logic Form | TRANSISTOR-TRANSISTOR LOGIC |
| Features Provided | BIPOLAR AND PROGRAMMED |
| Body Width | 0.245 INCHES MINIMUM AND 0.252 INCHES MAXIMUM IN |
| Body Length | 0.745 INCHES MINIMUM AND 0.755 INCHES MAXIMUM IN |
| Acquisition Status | CANCELLED |
| HAZMAT | No |
| Part Number | Manufacturer |
|---|---|
| N82S129N | Philips Semiconductors Inc (USA) |
| 23-160A2-00 PRIMARY | Compaq Federal Llc (USA) |
NSN 5962-01-234-6183 is a Microcircuit,memory, manufactured by Compaq Federal Llc, classified under FSC 5962 (No Item Name Available). Status: cancelled.
NSN 5962-01-234-6183 has 2 cross-referenced part numbers: N82S129N (Philips Semiconductors Inc), 23-160A2-00 (Compaq Federal Llc).
There are 12 known substitutes for 5962-01-234-6183: 5962-01-073-5470, 5962-01-073-5471, 5962-01-073-8501 and 9 more. Verify interchangeability with system specifications before substitution.
Key specifications for 23-160A2-00: Inclosure Material: PLASTIC; Memory Device Type: PROM; Inclosure Configuration: DUAL-IN-LINE; Terminal Surface Treatment: SOLDER. 10 total characteristics are documented in the Federal Logistics Information System.
NSN 5962-01-234-6183 is currently cancelled. Check with the Defense Logistics Agency for current availability and authorized substitutes.