The Microcircuit,memory, cataloged under National Stock Number 5962-01-217-4202, is classified within Federal Supply Class 5962 (Microcircuits, Electronic) of the Electrical and Electronic Equipment Components group. The manufacturer of record is L3 Technologies, Inc. Div Communication Systems-East. Government technical data includes 15 specifications, cited from the U.S. Government catalog. The record lists 1 manufacturer part number for this item, enabling identification through both NSN and commercial part number lookups. 4 additional reference documents (drawings, advisory and superseded references) are recorded in the U.S. Government catalog. 2 items share a part number with this NSN in the catalog (possible match — not a government interchangeability claim). Current acquisition status: Active.
| Parameter | Value |
|---|---|
| NSN | 5962-01-217-4202 |
| Primary Part Number | 8559989-53 |
| Item Name | Microcircuit,memory |
| FSC / FSG | 5962 / 59 — Microcircuits, Electronic |
| Manufacturer | L3 Technologies, Inc. Div Communication Systems-East |
| Status | ACTIVE |
| Input Circuit Pattern | 13 INPUT |
| Inclosure Material | CERAMIC |
| Terminal Surface Treatment | SOLDER |
| Body Width | 0.600 INCHES MAXIMUM IN |
| Body Height | 0.217 INCHES NOMINAL IN |
| Features Provided | MONOLITHIC AND HERMETICALLY SEALED AND PROGRAMMABLE |
| Inclosure Configuration | DUAL-IN-LINE |
| Memory Device Type | ROM |
| Body Length | 1.285 INCHES MAXIMUM IN |
| Storage Temp Range | -65.0 TO 125.0 CELSIUS DEGC |
| Output Logic Form | METAL OXIDE-SEMICONDUCTOR LOGIC |
| Voltage Rating and Type Per Characteristic | 5.0 VOLTS MAXIMUM POWER SOURCE |
| Operating Temp Range | -10.0 TO 80.0 CELSIUS DEGC |
| Terminal Type and Quantity | 24 PRINTED CIRCUIT |
| Maximum Power Dissipation Rating | 525.0 MILLIWATTS |
| Acquisition Status | ACTIVE |
| DEMIL Code | DEMIL Q — CCL Item — Commerce Control List |
| Hazard | No hazard code in the DLA record (HMIC N) |
| Criticality Code | X |
| Part Number | Manufacturer |
|---|---|
| 8559989-53 PRIMARY | L3 Technologies, Inc. Div Communication Systems-East (USA) |
| Reference | Meaning |
|---|---|
| 8563303 | 5/9 Secondary reference Lockheed Martin Corporation Dba Lockheed Martin Div Lockheed Martin |
| D2716-45 | 5/9 Secondary reference Intel Corp Sales Office |
| ROM/PROM | 5/1 Secondary reference Dla Land and Maritime Dba Engineering and Technical Support Div Document Standardization Division (vendor Item Drawings) |
| 8559989-53 | 3/9 Design control — primary reference Lockheed Martin Corporation Dba Lockheed Martin Div Lockheed Martin |
NSN 5962-01-217-4202 is a Microcircuit,memory, manufactured by L3 Technologies, Inc. Div Communication Systems-East, classified under FSC 5962, Microcircuits, Electronic. Status: active.
NSN 5962-01-217-4202 has 1 manufacturer part number on file: 8559989-53 (L3 Technologies, Inc. Div Communication Systems-East).
2 possible matches (shared part number, not a government interchangeability claim): 5962-01-217-4203, 5962-01-217-4204. Verify interchangeability with system specifications before substitution.
Key specifications for 8559989-53: Input Circuit Pattern: 13 INPUT; Inclosure Material: CERAMIC; Terminal Surface Treatment: SOLDER; Body Width: 0.600 INCHES MAXIMUM IN. 15 specifications are documented in the U.S. Government catalog.
No hazard code in the DLA record (HMIC N). Hazard information on this page is shown exactly as it appears in the DLA record.
NSN 5962-01-217-4202 has DEMIL Code Q. Demilitarization may be required before disposal or transfer to non-military entities.
U.S. Government catalog: edition PUBLOGDVD v12.0.0 (OCT 2026), edition date 2026-10-01, retrieved 2026-10-16.
U.S. Government catalog: edition PUBLOGDVD v12.0.0 (OCT 2026), edition date 2026-10-01, retrieved 2026-10-18.