The Microcircuit,memory, cataloged under National Stock Number 5962-01-199-8967, is classified within Federal Supply Class 5962 (No Item Name Available) of the Electrical and Electronic Equipment Components group. The primary manufacturer of record is Xicor Inc. Government technical data includes 16 verified specifications, sourced from the Federal Logistics Information System (FLIS). This item has 14 commercial cross-references from 10 manufacturers, enabling identification through both NSN and commercial part number lookups. 4 verified substitutes exist in the FLIS interchangeability database. Current acquisition status: Cancelled.
| Parameter | Value |
|---|---|
| NSN | 5962-01-199-8967 |
| Primary Part Number | X2212DMB |
| Item Name | Microcircuit,memory |
| FSC / FSG | 5962 / 59 — No Item Name Available |
| Manufacturer | Xicor Inc |
| Status | CANCELLED |
| Operating Temp Range | -55.0 TO 125.0 CELSIUS DEGC |
| Body Length | 0.880 INCHES MINIMUM AND 0.920 INCHES MAXIMUM IN |
| Body Height | 0.140 INCHES MINIMUM AND 0.165 INCHES MAXIMUM IN |
| Input Circuit Pattern | 16 INPUT |
| Voltage Rating and Type Per Characteristic | -1.0 VOLTS MINIMUM POWER SOURCE AND 6.0 VOLTS MAXIMUM POWER SOURCE |
| Time Rating Per Chacteristic | 300.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 300.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS |
| Terminal Surface Treatment | SOLDER |
| Memory Device Type | RAM |
| Test Data Document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| Terminal Type and Quantity | 18 PRINTED CIRCUIT |
| Features Provided | HERMETICALLY SEALED AND PROGRAMMABLE AND HIGH VOLTAGE AND STATIC OPERATION |
| Body Width | 0.265 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN |
| Inclosure Material | CERAMIC AND GLASS |
| Inclosure Configuration | DUAL-IN-LINE |
| Storage Temp Range | -65.0 TO 150.0 CELSIUS DEGC |
| Output Logic Form | N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
| Acquisition Status | CANCELLED |
| HAZMAT | No |
| Part Number | Manufacturer |
|---|---|
| X2212DMB PRIMARY | Xicor Inc (USA) |
| X2212DMB/10 | Xicor Inc (USA) |
| 7100587-1 | Electrodynamics Inc Div L3harris Electrodynamics Inc (USA) |
| X2212DM | Xicor Inc (USA) |
| 645A685H01 | Northrop Grumman Systems Corporation Dba Northrop Grumman Systems Corp (USA) |
| X2212-30MB/883B | Xicor Inc (USA) |
| 360413 | Ametek Programmable Power, Inc. (USA) |
| A584A482-101 | Kearfott Corporation Div Guidance and Navigation Division (USA) |
| H990714-001B | Raytheon Company Dba Raytheon (USA) |
| C5000943-1 | Department of the Army Hq U S Army Electronics Research and Development Command (USA) |
| X2212D | Safran Electrical Components Usa, Inc Div Safran Electrical Components Usa (USA) |
| X2212 | Nsgdatacom Inc (USA) |
| 360413 | California Instruments Corp (USA) |
| X2212DMB/5 | Xicor Inc (USA) |
NSN 5962-01-199-8967 is a Microcircuit,memory, manufactured by Xicor Inc, classified under FSC 5962 (No Item Name Available). Status: cancelled.
NSN 5962-01-199-8967 has 14 cross-referenced part numbers: X2212DMB (Xicor Inc), X2212DMB/10 (Xicor Inc), 7100587-1 (Electrodynamics Inc Div L3harris Electrodynamics Inc), X2212DM (Xicor Inc), 645A685H01 (Northrop Grumman Systems Corporation Dba Northrop Grumman Systems Corp) and 9 more.
There are 4 known substitutes for 5962-01-199-8967: 5930-00-617-5079, 5962-01-238-5512, 5310-01-477-1978 and 1 more. Verify interchangeability with system specifications before substitution.
Key specifications for X2212DMB: Operating Temp Range: -55.0 TO 125.0 CELSIUS DEGC; Body Length: 0.880 INCHES MINIMUM AND 0.920 INCHES MAXIMUM IN; Body Height: 0.140 INCHES MINIMUM AND 0.165 INCHES MAXIMUM IN; Input Circuit Pattern: 16 INPUT. 16 total characteristics are documented in the Federal Logistics Information System.
NSN 5962-01-199-8967 is currently cancelled. Check with the Defense Logistics Agency for current availability and authorized substitutes.