The Microcircuit,memory, cataloged under National Stock Number 5962-01-184-9043, is classified within Federal Supply Class 5962 (No Item Name Available) of the Electrical and Electronic Equipment Components group. The primary manufacturer of record is The Boeing Company Div Defense. Government technical data includes 18 verified specifications, sourced from the Federal Logistics Information System (FLIS). This item has 3 commercial cross-references from 3 manufacturers, enabling identification through both NSN and commercial part number lookups. 12 verified substitutes exist in the FLIS interchangeability database. Current acquisition status: Active.
| Parameter | Value |
|---|---|
| NSN | 5962-01-184-9043 |
| Primary Part Number | 53D410797-23 |
| Item Name | Microcircuit,memory |
| FSC / FSG | 5962 / 59 — No Item Name Available |
| Manufacturer | The Boeing Company Div Defense |
| Status | ACTIVE |
| Body Height | 0.205 INCHES MAXIMUM IN |
| Output Logic Form | N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
| Body Length | 1.290 INCHES MAXIMUM IN |
| Features Provided | HERMETICALLY SEALED AND MONOLITHIC AND ULTRAVIOLET ERASABLE AND HIGH SPEED |
| Terminal Type and Quantity | 24 PRINTED CIRCUIT |
| Capitance Rating Per Characteristic | 6.00 INPUT PICOFARADS MAXIMUM AND 12.00 OUTPUT PICOFARADS MAXIMUM |
| Memory Device Type | PROM |
| Time Rating Per Chacteristic | 2000.00 NANOSECONDS MAXIMUM DELAY NS |
| Current Rating Per Characteristic | 8.00 MILLIAMPERES MAXIMUM SUPPLY |
| Terminal Surface Treatment | SOLDER |
| Voltage Rating and Type Per Characteristic | -0.3 VOLTS MINIMUM POWER SOURCE AND 15.0 VOLTS MAXIMUM POWER SOURCE |
| Inclosure Material | CERAMIC |
| Inclosure Configuration | DUAL-IN-LINE |
| Maximum Power Dissipation Rating | 720.0 MILLIWATTS |
| Storage Temp Range | -55.0 TO 125.0 CELSIUS DEGC |
| Body Width | 0.600 INCHES MAXIMUM IN |
| Operating Temp Range | +0.0 TO 70.0 CELSIUS DEGC |
| Input Circuit Pattern | 12 INPUT |
| Acquisition Status | ACTIVE |
| HAZMAT | No |
| Part Number | Manufacturer |
|---|---|
| ROM/PROM | Dla Land and Maritime Dba Engineering and Technical Support Div Document Standardization Division (vendor Item Drawings) (USA) |
| 53D410797-23 PRIMARY | The Boeing Company Div Defense (USA) |
| TMS2716 | Texas Instruments Incorporated (USA) |
NSN 5962-01-184-9043 is a Microcircuit,memory, manufactured by The Boeing Company Div Defense, classified under FSC 5962 (No Item Name Available). Status: active.
NSN 5962-01-184-9043 has 3 cross-referenced part numbers: ROM/PROM (Dla Land and Maritime Dba Engineering and Technical Support Div Document Standardization Division (vendor Item Drawings)), 53D410797-23 (The Boeing Company Div Defense), TMS2716 (Texas Instruments Incorporated).
There are 12 known substitutes for 5962-01-184-9043: 5962-01-087-6738, 5962-01-184-9035, 5962-01-184-9036 and 9 more. Verify interchangeability with system specifications before substitution.
Key specifications for 53D410797-23: Body Height: 0.205 INCHES MAXIMUM IN; Output Logic Form: N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC; Body Length: 1.290 INCHES MAXIMUM IN; Features Provided: HERMETICALLY SEALED AND MONOLITHIC AND ULTRAVIOLET ERASABLE AND HIGH SPEED. 19 total characteristics are documented in the Federal Logistics Information System.