The Microcircuit,memory, cataloged under National Stock Number 5962-01-182-1591, is classified within Federal Supply Class 5962 (Microcircuits, Electronic) of the Electrical and Electronic Equipment Components group. The manufacturer of record is The Boeing Company Div Defense. Government technical data includes 17 specifications, cited from the U.S. Government catalog. The record lists 1 manufacturer part number for this item, enabling identification through both NSN and commercial part number lookups. 6 additional reference documents (drawings, advisory and superseded references) are recorded in the U.S. Government catalog. 1 item shares a part number with this NSN in the catalog (possible match — not a government interchangeability claim). Current acquisition status: Active.
| Parameter | Value |
|---|---|
| NSN | 5962-01-182-1591 |
| Primary Part Number | 74B059334-207 |
| Item Name | Microcircuit,memory |
| FSC / FSG | 5962 / 59 — Microcircuits, Electronic |
| Manufacturer | The Boeing Company Div Defense |
| Status | ACTIVE |
| Input Circuit Pattern | 10 INPUT |
| Inclosure Material | CERAMIC OR GLASS OR METAL |
| Terminal Surface Treatment | SOLDER |
| Body Width | 0.300 INCHES MAXIMUM IN |
| Body Height | 0.170 INCHES MAXIMUM IN |
| Features Provided | BIPOLAR AND PROGRAMMABLE AND PROGRAMMED AND HERMETICALLY SEALED |
| Inclosure Configuration | DUAL-IN-LINE |
| Memory Device Type | ROM |
| Body Length | 1.010 INCHES MAXIMUM IN |
| Storage Temp Range | -65.0 TO 150.0 CELSIUS DEGC |
| Output Logic Form | TRANSISTOR-TRANSISTOR LOGIC |
| Voltage Rating and Type Per Characteristic | 7.0 VOLTS MAXIMUM POWER SOURCE |
| Operating Temp Range | -55.0 TO 125.0 CELSIUS DEGC |
| Test Data Document | 89954-144A9552 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWING) |
| Terminal Type and Quantity | 20 PRINTED CIRCUIT |
| Maximum Power Dissipation Rating | 850.0 MILLIWATTS |
| Time Rating Per Chacteristic | 120.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT NS |
| Acquisition Status | ACTIVE |
| DEMIL Code | DEMIL D — Destroy Item |
| Hazard | No hazard code in the DLA record (HMIC N) |
| Criticality Code | X |
| Part Number | Manufacturer |
|---|---|
| 74B059334-207 | The Boeing Company Div Defense (USA) |
| Reference | Meaning |
|---|---|
| 144A9552P2 | 5/1 Secondary reference U.S. Government activity |
| DH75636 | 5/9 Secondary reference Intel Corp Sales Office |
| ROM/PROM FAMILY 016 | 5/1 Secondary reference Dla Land and Maritime Dba Engineering and Technical Support Div Document Standardization Division (vendor Item Drawings) |
| 144A9761P13 | 3/2 Design control — primary reference U.S. Government activity |
| 144A9938 | 5/1 Secondary reference U.S. Government activity |
| SM976 | 5/9 Secondary reference Mmi/amd |
NSN 5962-01-182-1591 is a Microcircuit,memory, manufactured by The Boeing Company Div Defense, classified under FSC 5962, Microcircuits, Electronic. Status: active.
NSN 5962-01-182-1591 has 1 manufacturer part number on file: 74B059334-207 (The Boeing Company Div Defense).
1 possible match (shared part number, not a government interchangeability claim): 5962-01-182-1592. Verify interchangeability with system specifications before substitution.
Key specifications for 74B059334-207: Input Circuit Pattern: 10 INPUT; Inclosure Material: CERAMIC OR GLASS OR METAL; Terminal Surface Treatment: SOLDER; Body Width: 0.300 INCHES MAXIMUM IN. 17 specifications are documented in the U.S. Government catalog.
No hazard code in the DLA record (HMIC N). Hazard information on this page is shown exactly as it appears in the DLA record.
NSN 5962-01-182-1591 has DEMIL Code D. Demilitarization may be required before disposal or transfer to non-military entities.
U.S. Government catalog: edition PUBLOGDVD v12.0.0 (OCT 2026), edition date 2026-10-01, retrieved 2026-10-16.
U.S. Government catalog: edition PUBLOGDVD v12.0.0 (OCT 2026), edition date 2026-10-01, retrieved 2026-10-18.