The Microcircuit,memory, cataloged under National Stock Number 5962-01-173-7145, is classified within Federal Supply Class 5962 (No Item Name Available) of the Electrical and Electronic Equipment Components group. The primary manufacturer of record is Renesas Electronics America Inc. Government technical data includes 17 verified specifications, sourced from the Federal Logistics Information System (FLIS). This item has 10 commercial cross-references from 10 manufacturers, enabling identification through both NSN and commercial part number lookups. 12 verified substitutes exist in the FLIS interchangeability database. Current acquisition status: Active.
| Parameter | Value |
|---|---|
| NSN | 5962-01-173-7145 |
| Primary Part Number | HM7611 |
| Item Name | Microcircuit,memory |
| FSC / FSG | 5962 / 59 — No Item Name Available |
| Manufacturer | Renesas Electronics America Inc |
| Status | ACTIVE |
| Storage Temp Range | -65.0 TO 150.0 CELSIUS DEGC |
| Features Provided | HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND SCHOTTKY AND 3-STATE OUTPUT |
| Test Data Document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| Time Rating Per Chacteristic | 75.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 75.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS |
| Terminal Type and Quantity | 16 PRINTED CIRCUIT |
| Voltage Rating and Type Per Characteristic | -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
| Memory Device Type | ROM |
| Terminal Surface Treatment | SOLDER |
| Maximum Power Dissipation Rating | 307.2 MILLIWATTS |
| Input Circuit Pattern | 10 INPUT |
| Inclosure Material | CERAMIC |
| Body Length | 0.740 INCHES MINIMUM AND 0.810 INCHES MAXIMUM IN |
| Body Width | 0.280 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN |
| Inclosure Configuration | DUAL-IN-LINE |
| Output Logic Form | TRANSISTOR-TRANSISTOR LOGIC |
| Operating Temp Range | -55.0 TO 125.0 CELSIUS DEGC |
| Body Height | 0.140 INCHES MAXIMUM IN |
| Acquisition Status | ACTIVE |
| HAZMAT | No |
| Part Number | Manufacturer |
|---|---|
| HM7611 | Renesas Electronics America Inc (USA) |
| 93427 | Fairchild Semiconductor Corp (USA) |
| 82S129 | Philips Semiconductors Inc (USA) |
| ROM/PROM FAMILY 005 | Dla Land and Maritime Dba Engineering and Technical Support Div Document Standardization Division (vendor Item Drawings) (USA) |
| AM27S11 | Advanced Micro Devices Inc Dba AMD Austin (USA) |
| 108626 | Datametrics Corporation (USA) |
| IM5623 | Intersil Inc Sub of General Electric Co (USA) |
| M3621 | Intel Corp Sales Office (USA) |
| 108626 | Rugged Information Technology Equipment Corporation Dba Rugged Information Technology Equipment (USA) |
| 5301-1 | Mmi/amd (USA) |
NSN 5962-01-173-7145 is a Microcircuit,memory, manufactured by Renesas Electronics America Inc, classified under FSC 5962 (No Item Name Available). Status: active.
NSN 5962-01-173-7145 has 10 cross-referenced part numbers: HM7611 (Renesas Electronics America Inc), 93427 (Fairchild Semiconductor Corp), 82S129 (Philips Semiconductors Inc), ROM/PROM FAMILY 005 (Dla Land and Maritime Dba Engineering and Technical Support Div Document Standardization Division (vendor Item Drawings)), AM27S11 (Advanced Micro Devices Inc Dba AMD Austin) and 5 more.
There are 12 known substitutes for 5962-01-173-7145: 2910-00-133-5709, 2805-00-136-8824, 6625-00-218-6511 and 9 more. Verify interchangeability with system specifications before substitution.
Key specifications for HM7611: Storage Temp Range: -65.0 TO 150.0 CELSIUS DEGC; Features Provided: HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND SCHOTTKY AND 3-STATE OUTPUT; Test Data Document: 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).; Time Rating Per Chacteristic: 75.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 75.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS. 17 total characteristics are documented in the Federal Logistics Information System.