The Microcircuit,memory, cataloged under National Stock Number 5962-01-161-3538, is classified within Federal Supply Class 5962 (No Item Name Available) of the Electrical and Electronic Equipment Components group. The primary manufacturer of record is Lockheed Martin Corporation Div Rms. Government technical data includes 18 verified specifications, sourced from the Federal Logistics Information System (FLIS). This item has 4 commercial cross-references from 4 manufacturers, enabling identification through both NSN and commercial part number lookups. 12 verified substitutes exist in the FLIS interchangeability database. Current acquisition status: Active.
| Parameter | Value |
|---|---|
| NSN | 5962-01-161-3538 |
| Primary Part Number | 77A102362P001 |
| Item Name | Microcircuit,memory |
| FSC / FSG | 5962 / 59 — No Item Name Available |
| Manufacturer | Lockheed Martin Corporation Div Rms |
| Status | ACTIVE |
| Features Provided | HERMETICALLY SEALED AND BURN IN AND BIPOLAR AND PROGRAMMABLE AND SCHOTTKY AND W/ENABLE AND W/ACTIVE PULL-UP |
| Body Width | 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN |
| Storage Temp Range | -65.0 TO 150.0 CELSIUS DEGC |
| Inclosure Material | CERAMIC |
| Case Outline Source and Designator | D-3 MIL-M-38510 |
| Voltage Rating and Type Per Characteristic | 5.5 VOLTS MAXIMUM POWER SOURCE |
| Memory Device Type | ROM |
| Time Rating Per Chacteristic | 100.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 100.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS |
| Terminal Type and Quantity | 24 PRINTED CIRCUIT |
| Memory Capacity | UNKNOWN |
| Terminal Surface Treatment | SOLDER |
| Body Length | 1.290 INCHES MAXIMUM IN |
| Operating Temp Range | -55.0 TO 125.0 CELSIUS DEGC |
| Maximum Power Dissipation Rating | 1.02 WATTS |
| Body Height | 0.210 INCHES MAXIMUM IN |
| Inclosure Configuration | DUAL-IN-LINE |
| Input Circuit Pattern | 14 INPUT |
| Output Logic Form | TRANSISTOR-TRANSISTOR LOGIC |
| Acquisition Status | ACTIVE |
| HAZMAT | No |
| Part Number | Manufacturer |
|---|---|
| 82S191 | Philips Semiconductors Inc (USA) |
| ROM/PROM FAMILY 029 | Dla Land and Maritime Dba Engineering and Technical Support Div Document Standardization Division (vendor Item Drawings) (USA) |
| M38510/21002BJB | Military Specifications Promulgated by Military Departments/agencies Under Authority of Defense Standardization Manual 4120 3-M |
| 77A102362P001 PRIMARY | Lockheed Martin Corporation Div Rms (USA) |
NSN 5962-01-161-3538 is a Microcircuit,memory, manufactured by Lockheed Martin Corporation Div Rms, classified under FSC 5962 (No Item Name Available). Status: active.
NSN 5962-01-161-3538 has 4 cross-referenced part numbers: 82S191 (Philips Semiconductors Inc), ROM/PROM FAMILY 029 (Dla Land and Maritime Dba Engineering and Technical Support Div Document Standardization Division (vendor Item Drawings)), M38510/21002BJB (Military Specifications Promulgated by Military Departments/agencies Under Authority of Defense Standardization Manual 4120 3-M), 77A102362P001 (Lockheed Martin Corporation Div Rms).
There are 12 known substitutes for 5962-01-161-3538: 5962-01-093-6160, 5962-01-161-3487, 5962-01-161-3488 and 9 more. Verify interchangeability with system specifications before substitution.
Key specifications for 77A102362P001: Features Provided: HERMETICALLY SEALED AND BURN IN AND BIPOLAR AND PROGRAMMABLE AND SCHOTTKY AND W/ENABLE AND W/ACTIVE PULL-UP; Body Width: 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN; Storage Temp Range: -65.0 TO 150.0 CELSIUS DEGC; Inclosure Material: CERAMIC. 19 total characteristics are documented in the Federal Logistics Information System.