The Microcircuit,memory, cataloged under National Stock Number 5962-01-159-6871, is classified within Federal Supply Class 5962 (No Item Name Available) of the Electrical and Electronic Equipment Components group. The primary manufacturer of record is Us Army Communications & Electronics Materiel Readiness Command Logistics Engineering Dir. Government technical data includes 17 verified specifications, sourced from the Federal Logistics Information System (FLIS). This item has 5 commercial cross-references from 3 manufacturers, enabling identification through both NSN and commercial part number lookups. 1 verified substitute exists in the FLIS interchangeability database. Current acquisition status: Active.
| Parameter | Value |
|---|---|
| NSN | 5962-01-159-6871 |
| Primary Part Number | SM-A-838873-8 |
| Item Name | Microcircuit,memory |
| FSC / FSG | 5962 / 59 — No Item Name Available |
| Manufacturer | Us Army Communications & Electronics Materiel Readiness Command Logistics Engineering Dir |
| Status | ACTIVE |
| Inclosure Material | CERAMIC AND GLASS |
| Storage Temp Range | -65.0 TO 150.0 CELSIUS DEGC |
| Input Circuit Pattern | 12 INPUT |
| Memory Device Type | ROM |
| Memory Capacity | UNKNOWN |
| Voltage Rating and Type Per Characteristic | 5.5 VOLTS MAXIMUM POWER SOURCE |
| Terminal Type and Quantity | 18 PRINTED CIRCUIT |
| Time Rating Per Chacteristic | 125.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 125.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS |
| Terminal Surface Treatment | SOLDER |
| Test Data Document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| Features Provided | HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND PROGRAMMABLE AND W/ENABLE |
| Operating Temp Range | -55.0 TO 125.0 CELSIUS DEGC |
| Output Logic Form | TRANSISTOR-TRANSISTOR LOGIC |
| Body Height | 0.120 INCHES MAXIMUM IN |
| Body Width | 0.280 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN |
| Inclosure Configuration | DUAL-IN-LINE |
| Body Length | 0.870 INCHES MINIMUM AND 0.930 INCHES MAXIMUM IN |
| Acquisition Status | ACTIVE |
| HAZMAT | No |
| Part Number | Manufacturer |
|---|---|
| SM-A-838873-8 | General Dynamics Mission Systems, Inc. (USA) |
| SM-A-838856-1 | Us Army Communications & Electronics Materiel Readiness Command Logistics Engineering Dir (USA) |
| SM-A-813143 | Us Army Communications & Electronics Materiel Readiness Command Logistics Engineering Dir (USA) |
| SM-A-838873-8 PRIMARY | Us Army Communications & Electronics Materiel Readiness Command Logistics Engineering Dir (USA) |
| SM-A-838873-8 | Philips Semiconductors Inc (USA) |
NSN 5962-01-159-6871 is a Microcircuit,memory, manufactured by Us Army Communications & Electronics Materiel Readiness Command Logistics Engineering Dir, classified under FSC 5962 (No Item Name Available). Status: active.
NSN 5962-01-159-6871 has 5 cross-referenced part numbers: SM-A-838873-8 (General Dynamics Mission Systems, Inc.), SM-A-838856-1 (Us Army Communications & Electronics Materiel Readiness Command Logistics Engineering Dir), SM-A-813143 (Us Army Communications & Electronics Materiel Readiness Command Logistics Engineering Dir), SM-A-838873-8 (Us Army Communications & Electronics Materiel Readiness Command Logistics Engineering Dir), SM-A-838873-8 (Philips Semiconductors Inc).
There is 1 known substitute for 5962-01-159-6871: 5962-01-159-7870. Verify interchangeability with system specifications before substitution.
Key specifications for SM-A-838873-8: Inclosure Material: CERAMIC AND GLASS; Storage Temp Range: -65.0 TO 150.0 CELSIUS DEGC; Input Circuit Pattern: 12 INPUT; Memory Device Type: ROM. 17 total characteristics are documented in the Federal Logistics Information System.