The Microcircuit,memory, cataloged under National Stock Number 5962-01-156-7980, is classified within Federal Supply Class 5962 (No Item Name Available) of the Electrical and Electronic Equipment Components group. The primary manufacturer of record is Us Army Communications & Electronics Materiel Readiness Command Logistics Engineering Dir. Government technical data includes 18 verified specifications, sourced from the Federal Logistics Information System (FLIS). This item has 5 commercial cross-references from 5 manufacturers, enabling identification through both NSN and commercial part number lookups. 7 verified substitutes exist in the FLIS interchangeability database. Current acquisition status: Active.
| Parameter | Value |
|---|---|
| NSN | 5962-01-156-7980 |
| Primary Part Number | SM-A-946593-02 |
| Item Name | Microcircuit,memory |
| FSC / FSG | 5962 / 59 — No Item Name Available |
| Manufacturer | Us Army Communications & Electronics Materiel Readiness Command Logistics Engineering Dir |
| Status | ACTIVE |
| Inclosure Material | CERAMIC AND GLASS |
| Input Circuit Pattern | 12 INPUT |
| Body Length | 0.960 INCHES MAXIMUM IN |
| Body Width | 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN |
| Test Data Document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| Voltage Rating and Type Per Characteristic | 7.0 VOLTS MAXIMUM POWER SOURCE |
| Terminal Type and Quantity | 18 PRINTED CIRCUIT |
| Memory Device Type | ROM |
| Case Outline Source and Designator | D-6 MIL-M-38510 |
| Terminal Surface Treatment | SOLDER |
| Time Rating Per Chacteristic | 85.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 85.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS |
| Inclosure Configuration | DUAL-IN-LINE |
| Features Provided | BIPOLAR AND SCHOTTKY AND MONOLITHIC AND 3-STATE OUTPUT AND PROGRAMMED |
| Operating Temp Range | -55.0 TO 125.0 CELSIUS DEGC |
| Output Logic Form | TRANSISTOR-TRANSISTOR LOGIC |
| Storage Temp Range | -65.0 TO 150.0 CELSIUS DEGC |
| Body Height | 0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN |
| Maximum Power Dissipation Rating | 794.0 MILLIWATTS |
| Acquisition Status | ACTIVE |
| HAZMAT | No |
| Part Number | Manufacturer |
|---|---|
| SM-A-946593-02 PRIMARY | Us Army Communications & Electronics Materiel Readiness Command Logistics Engineering Dir (USA) |
| ROM/PROM FAMILY 030 | Dla Land and Maritime Dba Engineering and Technical Support Div Document Standardization Division (vendor Item Drawings) (USA) |
| M38510/20602BVX | Military Specifications Promulgated by Military Departments/agencies Under Authority of Defense Standardization Manual 4120 3-M |
| JM38510/20602BVX | Philips Semiconductors Inc (USA) |
| 30696-02 | L3 Technologies, Inc. Div Communication Systems-West (USA) |
NSN 5962-01-156-7980 is a Microcircuit,memory, manufactured by Us Army Communications & Electronics Materiel Readiness Command Logistics Engineering Dir, classified under FSC 5962 (No Item Name Available). Status: active.
NSN 5962-01-156-7980 has 5 cross-referenced part numbers: SM-A-946593-02 (Us Army Communications & Electronics Materiel Readiness Command Logistics Engineering Dir), ROM/PROM FAMILY 030 (Dla Land and Maritime Dba Engineering and Technical Support Div Document Standardization Division (vendor Item Drawings)), M38510/20602BVX (Military Specifications Promulgated by Military Departments/agencies Under Authority of Defense Standardization Manual 4120 3-M), JM38510/20602BVX (Philips Semiconductors Inc), 30696-02 (L3 Technologies, Inc. Div Communication Systems-West).
There are 7 known substitutes for 5962-01-156-7980: 5962-01-184-9018, 5962-01-214-2150, 5962-01-214-2151 and 4 more. Verify interchangeability with system specifications before substitution.
Key specifications for SM-A-946593-02: Inclosure Material: CERAMIC AND GLASS; Input Circuit Pattern: 12 INPUT; Body Length: 0.960 INCHES MAXIMUM IN; Body Width: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN. 19 total characteristics are documented in the Federal Logistics Information System.