The Microcircuit,memory, cataloged under National Stock Number 5962-01-061-1073, is classified within Federal Supply Class 5962 (No Item Name Available) of the Electrical and Electronic Equipment Components group. The primary manufacturer of record is Mcdonnell Douglas Corp Mcdonnell Douglas Electronic Systems Co. Government technical data includes 15 verified specifications, sourced from the Federal Logistics Information System (FLIS). This item has 4 commercial cross-references from 4 manufacturers, enabling identification through both NSN and commercial part number lookups. 6 verified substitutes exist in the FLIS interchangeability database. Current acquisition status: Active.
| Parameter | Value |
|---|---|
| NSN | 5962-01-061-1073 |
| Primary Part Number | H06G1717-210 |
| Item Name | Microcircuit,memory |
| FSC / FSG | 5962 / 59 — No Item Name Available |
| Manufacturer | Mcdonnell Douglas Corp Mcdonnell Douglas Electronic Systems Co |
| Status | ACTIVE |
| Features Provided | HERMETICALLY SEALED AND MONOLITHIC AND BIPOLAR AND PROGRAMMABLE AND 3-STATE OUTPUT |
| Voltage Rating and Type Per Characteristic | -1.5 VOLTS MINIMUM POWER SOURCE AND 5.5 VOLTS MAXIMUM POWER SOURCE |
| Terminal Type and Quantity | 16 PRINTED CIRCUIT |
| Memory Device Type | ROM |
| Time Rating Per Chacteristic | 30.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 25.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS |
| Terminal Surface Treatment | SOLDER |
| Inclosure Configuration | DUAL-IN-LINE |
| Body Length | 0.740 INCHES MINIMUM AND 0.810 INCHES MAXIMUM IN |
| Body Width | 0.280 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN |
| Inclosure Material | CERAMIC |
| Output Logic Form | TRANSISTOR-TRANSISTOR LOGIC |
| Body Height | 0.140 INCHES MINIMUM AND 0.145 INCHES MAXIMUM IN |
| Operating Temp Range | -55.0 TO 125.0 CELSIUS DEGC |
| Input Circuit Pattern | 6 INPUT |
| Storage Temp Range | -65.0 TO 150.0 CELSIUS DEGC |
| Acquisition Status | ACTIVE |
| HAZMAT | No |
| Part Number | Manufacturer |
|---|---|
| H06G1717-210 | Mcdonnell Douglas Corp Mcdonnell Douglas Electronic Systems Co (USA) |
| ROM/PROM | Dla Land and Maritime Dba Engineering and Technical Support Div Document Standardization Division (vendor Item Drawings) (USA) |
| H06G1717-210 | Flightsafety International Inc. (USA) |
| 5331-1D | Mmi/amd (USA) |
NSN 5962-01-061-1073 is a Microcircuit,memory, manufactured by Mcdonnell Douglas Corp Mcdonnell Douglas Electronic Systems Co, classified under FSC 5962 (No Item Name Available). Status: active.
NSN 5962-01-061-1073 has 4 cross-referenced part numbers: H06G1717-210 (Mcdonnell Douglas Corp Mcdonnell Douglas Electronic Systems Co), ROM/PROM (Dla Land and Maritime Dba Engineering and Technical Support Div Document Standardization Division (vendor Item Drawings)), H06G1717-210 (Flightsafety International Inc.), 5331-1D (Mmi/amd).
There are 6 known substitutes for 5962-01-061-1073: 5962-01-039-3430, 5962-01-061-1061, 5962-01-061-9144 and 3 more. Verify interchangeability with system specifications before substitution.
Key specifications for H06G1717-210: Features Provided: HERMETICALLY SEALED AND MONOLITHIC AND BIPOLAR AND PROGRAMMABLE AND 3-STATE OUTPUT; Voltage Rating and Type Per Characteristic: -1.5 VOLTS MINIMUM POWER SOURCE AND 5.5 VOLTS MAXIMUM POWER SOURCE; Terminal Type and Quantity: 16 PRINTED CIRCUIT; Memory Device Type: ROM. 16 total characteristics are documented in the Federal Logistics Information System.