The Microcircuit,memory, cataloged under National Stock Number 5962-01-038-3517, is classified within Federal Supply Class 5962 (No Item Name Available) of the Electrical and Electronic Equipment Components group. The primary manufacturer of record is Lockheed Martin Corporation Div Lockheed Martin Systems & Global Solutions. Government technical data includes 17 verified specifications, sourced from the Federal Logistics Information System (FLIS). This item has 8 commercial cross-references from 8 manufacturers, enabling identification through both NSN and commercial part number lookups. 12 verified substitutes exist in the FLIS interchangeability database. Current acquisition status: Active.
| Parameter | Value |
|---|---|
| NSN | 5962-01-038-3517 |
| Primary Part Number | 3214006-003-625 |
| Item Name | Microcircuit,memory |
| FSC / FSG | 5962 / 59 — No Item Name Available |
| Manufacturer | Lockheed Martin Corporation Div Lockheed Martin Systems & Global Solutions |
| Status | ACTIVE |
| Test Data Document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| Memory Device Type | PROM |
| Memory Capacity | UNKNOWN |
| Terminal Surface Treatment | SOLDER |
| Time Rating Per Chacteristic | 40.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 40.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS |
| Voltage Rating and Type Per Characteristic | 7.0 VOLTS MAXIMUM POWER SOURCE |
| Terminal Type and Quantity | 16 PRINTED CIRCUIT |
| Body Width | 0.245 INCHES MINIMUM AND 0.300 INCHES MAXIMUM IN |
| Input Circuit Pattern | 6 INPUT |
| Inclosure Material | CERAMIC |
| Operating Temp Range | -55.0 TO 125.0 CELSIUS DEGC |
| Inclosure Configuration | DUAL-IN-LINE |
| Storage Temp Range | -65.0 TO 150.0 CELSIUS DEGC |
| Body Length | 0.755 INCHES MINIMUM AND 0.785 INCHES MAXIMUM IN |
| Output Logic Form | TRANSISTOR-TRANSISTOR LOGIC |
| Body Height | 0.180 INCHES MAXIMUM IN |
| Features Provided | HERMETICALLY SEALED AND PROGRAMMABLE AND W/OPEN COLLECTOR AND BIPOLAR AND W/ENABLE |
| Acquisition Status | ACTIVE |
| HAZMAT | No |
| Part Number | Manufacturer |
|---|---|
| IM5600MDE/883B | Intersil Inc Sub of General Electric Co (USA) |
| S82S23F/883B | Philips Semiconductors Inc (USA) |
| ROM/PROM | Dla Land and Maritime Dba Engineering and Technical Support Div Document Standardization Division (vendor Item Drawings) (USA) |
| 3214006-003-625 PRIMARY | Lockheed Martin Corporation Div Lockheed Martin Systems & Global Solutions (USA) |
| SNC54S188J | Texas Instruments Incorporated (USA) |
| 5330D/883B | Mmi/amd (USA) |
| DM7577D/883B | National Semiconductor Corporation (USA) |
| HM1-7602-8 | Renesas Electronics America Inc (USA) |
NSN 5962-01-038-3517 is a Microcircuit,memory, manufactured by Lockheed Martin Corporation Div Lockheed Martin Systems & Global Solutions, classified under FSC 5962 (No Item Name Available). Status: active.
NSN 5962-01-038-3517 has 8 cross-referenced part numbers: IM5600MDE/883B (Intersil Inc Sub of General Electric Co), S82S23F/883B (Philips Semiconductors Inc), ROM/PROM (Dla Land and Maritime Dba Engineering and Technical Support Div Document Standardization Division (vendor Item Drawings)), 3214006-003-625 (Lockheed Martin Corporation Div Lockheed Martin Systems & Global Solutions), SNC54S188J (Texas Instruments Incorporated) and 3 more.
There are 12 known substitutes for 5962-01-038-3517: 5962-01-003-3995, 5962-01-009-3105, 5962-01-009-4167 and 9 more. Verify interchangeability with system specifications before substitution.
Key specifications for 3214006-003-625: Test Data Document: 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).; Memory Device Type: PROM; Memory Capacity: UNKNOWN; Terminal Surface Treatment: SOLDER. 17 total characteristics are documented in the Federal Logistics Information System.