The Microcircuit,memory, cataloged under National Stock Number 5962-01-011-3484, is classified within Federal Supply Class 5962 (No Item Name Available) of the Electrical and Electronic Equipment Components group. The primary manufacturer of record is General Dynamics Mission Systems, Inc. Dba Gdms. Government technical data includes 16 verified specifications, sourced from the Federal Logistics Information System (FLIS). This item has 7 commercial cross-references from 6 manufacturers, enabling identification through both NSN and commercial part number lookups. 11 verified substitutes exist in the FLIS interchangeability database. Current acquisition status: Active.
| Parameter | Value |
|---|---|
| NSN | 5962-01-011-3484 |
| Primary Part Number | 51-P01508E112A |
| Item Name | Microcircuit,memory |
| FSC / FSG | 5962 / 59 — No Item Name Available |
| Manufacturer | General Dynamics Mission Systems, Inc. Dba Gdms |
| Status | ACTIVE |
| Inclosure Configuration | DUAL-IN-LINE |
| Inclosure Material | CERAMIC AND GLASS |
| Memory Device Type | ROM |
| Terminal Surface Treatment | SOLDER |
| Voltage Rating and Type Per Characteristic | 5.5 VOLTS MAXIMUM POWER SOURCE |
| Test Data Document | 94990-51-+01508E DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWING) |
| Terminal Type and Quantity | 16 PRINTED CIRCUIT |
| Time Rating Per Chacteristic | 65.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT NS |
| Features Provided | HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND W/ENABLE AND PROGRAMMABLE AND PROGRAMMED AND HIGH SPEED AND W/OPEN COLLECTOR |
| Body Width | 0.220 INCHES MINIMUM AND 0.280 INCHES MAXIMUM IN |
| Storage Temp Range | -65.0 TO 150.0 CELSIUS DEGC |
| Body Height | 0.140 INCHES MINIMUM AND 0.180 INCHES MAXIMUM IN |
| Input Circuit Pattern | 10 INPUT |
| Operating Temp Range | -55.0 TO 125.0 CELSIUS DEGC |
| Body Length | 0.750 INCHES MINIMUM AND 0.785 INCHES MAXIMUM IN |
| Output Logic Form | TRANSISTOR-TRANSISTOR LOGIC |
| Acquisition Status | ACTIVE |
| HAZMAT | No |
| Part Number | Manufacturer |
|---|---|
| HM1-7610-8 | Renesas Electronics America Inc (USA) |
| HPROM1-1024A-8 | Renesas Electronics America Inc (USA) |
| ROM/PROM FAMILY 021 | Dla Land and Maritime Dba Engineering and Technical Support Div Document Standardization Division (vendor Item Drawings) (USA) |
| IM5603AMDE | Intersil Inc Sub of General Electric Co (USA) |
| MM5300J | Mmi/amd (USA) |
| 51-P01508E112A PRIMARY | General Dynamics Mission Systems, Inc. Dba Gdms (USA) |
| 51-P01508E112A | Motorola Inc. Dba Integrated Information Systems Group (USA) |
NSN 5962-01-011-3484 is a Microcircuit,memory, manufactured by General Dynamics Mission Systems, Inc. Dba Gdms, classified under FSC 5962 (No Item Name Available). Status: active.
NSN 5962-01-011-3484 has 7 cross-referenced part numbers: HM1-7610-8 (Renesas Electronics America Inc), HPROM1-1024A-8 (Renesas Electronics America Inc), ROM/PROM FAMILY 021 (Dla Land and Maritime Dba Engineering and Technical Support Div Document Standardization Division (vendor Item Drawings)), IM5603AMDE (Intersil Inc Sub of General Electric Co), MM5300J (Mmi/amd) and 2 more.
There are 11 known substitutes for 5962-01-011-3484: 5962-01-011-1332, 5962-01-011-1333, 5962-01-011-1334 and 8 more. Verify interchangeability with system specifications before substitution.
Key specifications for 51-P01508E112A: Inclosure Configuration: DUAL-IN-LINE; Inclosure Material: CERAMIC AND GLASS; Memory Device Type: ROM; Terminal Surface Treatment: SOLDER. 16 total characteristics are documented in the Federal Logistics Information System.