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5961PL0969613 — SEMICONDUCTOR DEVICE ASSEMBLY

✓ Government record, cited
— · SFP TRANSCEIVER
PRODUCT OVERVIEW

5961PL0969613: SEMICONDUCTOR DEVICE ASSEMBLY.

The SEMICONDUCTOR DEVICE ASSEMBLY is a the manufacturer industrial component. Key specifications include overall_width: 2.470 INCHES MINIMUM AND 2.530 INCHES MAXIMUM IN, overall_length: 5.470 INCHES MINIMUM AND 5.530 INCHES MAXIMUM IN, major_components: SEMICONDUCTOR DEVICE,DIODE 18; TERMINALS 36; TERMINAL BOARD 1, mounting_configuration: FOUR 0.177 IN. DIA.

MOUNTING HOLES IN. This part is cataloged in the U.S. Government catalog under NSN 5961-01-120-7204, indicating validated use in U.S.

government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels. Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
5961PL0969613
NSN: 5961-01-120-7204
FSC: 5961 — Semiconductor Devices and Associated Hardware
CAGE: 9009H — JEDNOLITY INDEKS MATERIALOWY - UNIFORM MATERIAL INDEX (POL)
SPECIFICATIONS
overall_width2.470 INCHES MINIMUM AND 2.530 INCHES MAXIMUM IN
overall_length5.470 INCHES MINIMUM AND 5.530 INCHES MAXIMUM IN
major_componentsSEMICONDUCTOR DEVICE,DIODE 18; TERMINALS 36; TERMINAL BOARD 1
mounting_configurationFOUR 0.177 IN. DIA. MOUNTING HOLES IN
NSN5961-01-120-7204
COMPONENT DIAGRAM
BAIL LATCH 10G SFP+ 850nm · SR (MMF, 300m) DOM: Digital Optical Monitoring TX RX LC DUPLEX 20-PIN EDGE CONNECTOR ~56.5 mm ~13.4mm SFP+ TRANSCEIVER | 10G | 850nm | SR (MMF, 300m) Hot-swappable | LC duplex fiber | DDM/DOM supported TITLE SFP+ XCVR PN 5961PL0969613 MFR OEM SEMICONDUCTOR DEVICE ASSEMBLY
KEY FEATURES
•
MAJOR COMPONENTS: SEMICONDUCTOR DEVICE,DIODE 18; TERMINALS 36; TERMINAL BOARD 1
•
MOUNTING CONFIGURATION: FOUR 0.177 IN. DIA. MOUNTING HOLES IN
TECHNICAL CHARACTERISTICS
MAJOR COMPONENTSSEMICONDUCTOR DEVICE,DIODE 18; TERMINALS 36; TERMINAL BOARD 1
OVERALL LENGTH5.470 INCHES MINIMUM AND 5.530 INCHES MAXIMUM IN
OVERALL WIDTH2.470 INCHES MINIMUM AND 2.530 INCHES MAXIMUM IN
MOUNTING CONFIGURATIONFOUR 0.177 IN. DIA. MOUNTING HOLES IN
OTHER ITEMS IN FSC 5961 — Semiconductor Devices and Associated Hardware
Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.
5961-00-000-0150 5961-00-000-4541 5961-00-000-5400 5961-00-000-7614 5961-00-000-8760 5961-00-001-1352 5961-00-001-2624 5961-00-001-2978
SUBSTITUTES & CROSS-REFERENCES

No substitute or cross-reference records for this part.

LIFECYCLE
NSN statusActive· U.S. Government catalog
Acquisition advice: Normally procured from the manufacturer (OEM)Demilitarization required — mutilation + specific procedure
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FREQUENTLY ASKED QUESTIONS
What is 5961PL0969613?
5961PL0969613 is a SEMICONDUCTOR DEVICE ASSEMBLY.
What is the NSN for 5961PL0969613?
5961PL0969613 is cataloged in the U.S. Government catalog under NSN 5961-01-120-7204. This indicates validated use in U.S. government and defense supply chains.
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✓ PartsTable — the parts reference. Every fact cited to its source.
PartsTable Design LLC · partstable.com
U.S. Government catalog: edition PUBLOGDVD v12.0.0 (OCT 2026), edition date 2026-10-01, retrieved 2026-10-18.
PartsTable commercial catalog: edition Unified commercial catalog snapshot through 2026-09-28, edition date not on file, retrieved 2026-09-28.