The SEMICONDUCTOR DEVICE,DIODE is a the manufacturer industrial component. Key specifications include material: SILICON SEMICONDUCTOR, overall_length: 0.300 INCHES NOMINAL IN, mounting_method: TERMINAL, terminal_length: 1.000 INCHES NOMINAL IN, overall_diameter: 0.092 INCHES MINIMUM AND 0.104 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED CASE. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5961-00-461-3196, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| material | SILICON SEMICONDUCTOR |
| overall_length | 0.300 INCHES NOMINAL IN |
| mounting_method | TERMINAL |
| terminal_length | 1.000 INCHES NOMINAL IN |
| overall_diameter | 0.092 INCHES MINIMUM AND 0.104 INCHES MAXIMUM IN |
| features_provided | HERMETICALLY SEALED CASE |
| terminal_type_and_quantity | 2 UNINSULATED WIRE LEAD |
| maximum_operating_temp_per_measurement_point | 175.0 CELSIUS JUNCTION DEGC |
| NSN | 5961-00-461-3196 |
| OVERALL DIAMETER | 0.092 INCHES MINIMUM AND 0.104 INCHES MAXIMUM IN |
| FEATURES PROVIDED | HERMETICALLY SEALED CASE |
| MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 175.0 CELSIUS JUNCTION DEGC |
| TERMINAL LENGTH | 1.000 INCHES NOMINAL IN |
| TERMINAL TYPE AND QUANTITY | 2 UNINSULATED WIRE LEAD |
| MOUNTING METHOD | TERMINAL |
| OVERALL LENGTH | 0.300 INCHES NOMINAL IN |
| MATERIAL | GLASS ENCLOSURE |
| MATERIAL | SILICON SEMICONDUCTOR |