The Semiconductor Device,diode, cataloged under National Stock Number 5961-01-412-7980, is classified within Federal Supply Class 5961 (Semiconductor Devices and Associated Hardware) of the Electrical and Electronic Equipment Components group. The manufacturer of record is Avago Technologies Us Inc Div Avago Technologies. Government technical data includes 4 specifications, cited from the U.S. Government catalog. The record lists 3 manufacturer part numbers for this item, enabling identification through both NSN and commercial part number lookups. 2 additional reference documents (drawings, advisory and superseded references) are recorded in the U.S. Government catalog. Current acquisition status: Active.
| Parameter | Value |
|---|---|
| NSN | 5961-01-412-7980 |
| Primary Part Number | HSMP-3802 |
| Item Name | Semiconductor Device,diode |
| FSC / FSG | 5961 / 59 — Semiconductor Devices and Associated Hardware |
| Manufacturer | Avago Technologies Us Inc Div Avago Technologies |
| Status | ACTIVE |
| Mounting Method | TERMINAL |
| Function for Which Designed | MICROWAVE |
| Material | SILICON SEMICONDUCTOR |
| Material | PLASTIC ENCLOSURE |
| Acquisition Status | ACTIVE |
| DEMIL Code | DEMIL Q — CCL Item — Commerce Control List |
| Hazard | No hazard code in the DLA record (HMIC N) |
| Criticality Code | X |
| Part Number | Manufacturer |
|---|---|
| 77089967 | Nokia Networks France (FRA) |
| 91706604 | Thales Sa (FRA) |
| HSMP-3802 PRIMARY | Avago Technologies Us Inc Div Avago Technologies (USA) |
| Reference | Meaning |
|---|---|
| 77089967 | 5/9 Secondary reference Alcatel Telspace |
| HSMP-3802 | 5/9 Secondary reference Hewlett-Packard Company Dba HP |
NSN 5961-01-412-7980 is a Semiconductor Device,diode, manufactured by Avago Technologies Us Inc Div Avago Technologies, classified under FSC 5961, Semiconductor Devices and Associated Hardware. Status: active.
NSN 5961-01-412-7980 has 3 manufacturer part numbers on file: 77089967 (Nokia Networks France), 91706604 (Thales Sa), HSMP-3802 (Avago Technologies Us Inc Div Avago Technologies).
Key specifications for HSMP-3802: Mounting Method: TERMINAL; Function for Which Designed: MICROWAVE; Material: SILICON SEMICONDUCTOR; Material: PLASTIC ENCLOSURE. 4 specifications are documented in the U.S. Government catalog.
No hazard code in the DLA record (HMIC N). Hazard information on this page is shown exactly as it appears in the DLA record.
NSN 5961-01-412-7980 has DEMIL Code Q. Demilitarization may be required before disposal or transfer to non-military entities.
U.S. Government catalog: edition PUBLOGDVD v12.0.0 (OCT 2026), edition date 2026-10-01, retrieved 2026-10-16.
U.S. Government catalog: edition PUBLOGDVD v12.0.0 (OCT 2026), edition date 2026-10-01, retrieved 2026-10-18.