The Semiconductor Device,diode, cataloged under National Stock Number 5961-01-236-4452, is classified within Federal Supply Class 5961 (No Item Name Available) of the Electrical and Electronic Equipment Components group. The primary manufacturer of record is Microsemi Corporation. Government technical data includes 7 verified specifications, sourced from the Federal Logistics Information System (FLIS). This item has 2 commercial cross-references from 2 manufacturers, enabling identification through both NSN and commercial part number lookups. 1 verified substitute exists in the FLIS interchangeability database. Current acquisition status: Active.
| Parameter | Value |
|---|---|
| NSN | 5961-01-236-4452 |
| Primary Part Number | MB2638 |
| Item Name | Semiconductor Device,diode |
| FSC / FSG | 5961 / 59 — No Item Name Available |
| Manufacturer | Microsemi Corporation |
| Status | ACTIVE |
| Terminal Type and Quantity | 2 UNINSULATED WIRE LEAD |
| Nuclear Hardness Critical Feature | HARDENED |
| Features Provided | HERMETICALLY SEALED CASE |
| Material | SILICON SEMICONDUCTOR |
| Mounting Method | TERMINAL |
| Voltage Rating in Volts Per Characteristic | 600.0 MAXIMUM WORKING PEAK REVERSE VOLTAGE, MAXIMUM PEAK TOTAL VALUE |
| Material | GLASS ENCLOSURE |
| Acquisition Status | ACTIVE |
| HAZMAT | No |
| Part Number | Manufacturer |
|---|---|
| MB2638 | Microsemi Corporation (USA) |
| 280-20042-107 | The Boeing Company Div Defense (USA) |
NSN 5961-01-236-4452 is a Semiconductor Device,diode, manufactured by Microsemi Corporation, classified under FSC 5961 (No Item Name Available). Status: active.
NSN 5961-01-236-4452 has 2 cross-referenced part numbers: MB2638 (Microsemi Corporation), 280-20042-107 (The Boeing Company Div Defense).
There is 1 known substitute for 5961-01-236-4452: 5961-01-250-9724. Verify interchangeability with system specifications before substitution.
Key specifications for MB2638: Terminal Type and Quantity: 2 UNINSULATED WIRE LEAD; Nuclear Hardness Critical Feature: HARDENED; Features Provided: HERMETICALLY SEALED CASE; Material: SILICON SEMICONDUCTOR. 9 total characteristics are documented in the Federal Logistics Information System.