The Semiconductor Device Assembly, cataloged under National Stock Number 5961-01-162-2189, is classified within Federal Supply Class 5961 (No Item Name Available) of the Electrical and Electronic Equipment Components group. The primary manufacturer of record is Bell Textron Inc. Government technical data includes 1 verified specification, sourced from the Federal Logistics Information System (FLIS). This item has 1 commercial cross-reference from 1 manufacturer, enabling identification through both NSN and commercial part number lookups. 2 verified substitutes exist in the FLIS interchangeability database. Current acquisition status: Active.
| Parameter | Value |
|---|---|
| NSN | 5961-01-162-2189 |
| Primary Part Number | 30-214-1 |
| Item Name | Semiconductor Device Assembly |
| FSC / FSG | 5961 / 59 — No Item Name Available |
| Manufacturer | Bell Textron Inc |
| Status | ACTIVE |
| Major Components | DIODE 2; HEAT SHRINK TUBE 1 |
| Acquisition Status | ACTIVE |
| HAZMAT | No |
| Part Number | Manufacturer |
|---|---|
| 30-214-1 PRIMARY | Bell Textron Inc (USA) |
NSN 5961-01-162-2189 is a Semiconductor Device Assembly, manufactured by Bell Textron Inc, classified under FSC 5961 (No Item Name Available). Status: active.
NSN 5961-01-162-2189 has 1 cross-referenced part number: 30-214-1 (Bell Textron Inc).
There are 2 known substitutes for 5961-01-162-2189: 5330-00-949-9274, 5365-00-986-1818. Verify interchangeability with system specifications before substitution.
Key specifications for 30-214-1: Major Components: DIODE 2; HEAT SHRINK TUBE 1. 1 total characteristics are documented in the Federal Logistics Information System.