The Semiconductor Device,diode, cataloged under National Stock Number 5961-00-870-7824, is classified within Federal Supply Class 5961 (No Item Name Available) of the Electrical and Electronic Equipment Components group. The primary manufacturer of record is Electronic Industries Association. Government technical data includes 13 verified specifications, sourced from the Federal Logistics Information System (FLIS). This item has 7 commercial cross-references from 6 manufacturers, enabling identification through both NSN and commercial part number lookups. 12 verified substitutes exist in the FLIS interchangeability database. Current acquisition status: Cancelled.
| Parameter | Value |
|---|---|
| NSN | 5961-00-870-7824 |
| Primary Part Number | RELEASE 3669 |
| Item Name | Semiconductor Device,diode |
| FSC / FSG | 5961 / 59 — No Item Name Available |
| Manufacturer | Electronic Industries Association |
| Status | CANCELLED |
| Thread Series Designator | UNF |
| Terminal Type and Quantity | 1 TAB, SOLDER LUG AND 1 THREADED STUD |
| Material | SILICON SEMICONDUCTOR |
| Mounting Method | THREADED STUD(S) |
| Current Rating Per Characteristic | 890.00 MILLIAMPERES MAXIMUM MAXIMUM REVERSE SURGE CURRENT |
| Voltage Rating in Volts Per Characteristic | 14.0 MAXIMUM NOMINAL REGULATOR VOLTAGE |
| Power Rating Per Characteristic | 50.0 WATTS MAXIMUM TOTAL POWER DISSIPATION |
| Overall Diameter | 0.667 INCHES MAXIMUM IN |
| Nominal Thread Size | 0.250 INCHES IN |
| Maximum Operating Temp Per Measurement Point | 175.0 CELSIUS JUNCTION DEGC |
| Mounting Facility Quantity | 1 |
| Features Provided | HERMETICALLY SEALED CASE |
| Specification/standard Data | 80131-RELEASE3669 PROFESSIONAL/INDUSTRIAL ASSOCIATION SPECIFICATION |
| Acquisition Status | CANCELLED |
| HAZMAT | No |
| Part Number | Manufacturer |
|---|---|
| RELEASE 3669 | Electronic Industries Association |
| 1N3313B | General Dynamics Mission Systems, Inc. Dba Gdms (USA) |
| 1N3313B | Nxp Semiconductors France (FRA) |
| JAN1N3313B | Military Specifications Promulgated by Military Departments/agencies Under Authority of Defense Standardization Manual 4120 3-M |
| 1N3313B | Electronic Industries Association |
| 1N3313B | Microsemi Corp.-Scottsdale Dba Microsemi (USA) |
| 1N3313 | Infineon Technologies Americas Corp (USA) |
NSN 5961-00-870-7824 is a Semiconductor Device,diode, manufactured by Electronic Industries Association, classified under FSC 5961 (No Item Name Available). Status: cancelled.
NSN 5961-00-870-7824 has 7 cross-referenced part numbers: RELEASE 3669 (Electronic Industries Association), 1N3313B (General Dynamics Mission Systems, Inc. Dba Gdms), 1N3313B (Nxp Semiconductors France), JAN1N3313B (Military Specifications Promulgated by Military Departments/agencies Under Authority of Defense Standardization Manual 4120 3-M), 1N3313B (Electronic Industries Association) and 2 more.
There are 12 known substitutes for 5961-00-870-7824: 5961-00-007-7659, 5961-00-053-9437, 5961-00-115-2274 and 9 more. Verify interchangeability with system specifications before substitution.
Key specifications for RELEASE 3669: Thread Series Designator: UNF; Terminal Type and Quantity: 1 TAB, SOLDER LUG AND 1 THREADED STUD; Material: SILICON SEMICONDUCTOR; Mounting Method: THREADED STUD(S). 14 total characteristics are documented in the Federal Logistics Information System.
NSN 5961-00-870-7824 is currently cancelled. Check with the Defense Logistics Agency for current availability and authorized substitutes.