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5882733 — MICROCIRCUIT,MEMORY

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

5882733: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.310 INCHES MAXIMUM IN, body_height: 0.185 INCHES MAXIMUM IN, body_length: 0.840 INCHES MAXIMUM IN, features_provided: MONOLITHIC AND SCHOTTKY AND PROGRAMMABLE AND BIPOLAR, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-230-9595, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
5882733
NSN: 5962-01-230-9595
FSC: 5962 — Microcircuits, Electronic
CAGE: 53711 — NAVAL SEA SYSTEMS COMMAND (USA)
SPECIFICATIONS
body_width0.310 INCHES MAXIMUM IN
body_height0.185 INCHES MAXIMUM IN
body_length0.840 INCHES MAXIMUM IN
features_providedMONOLITHIC AND SCHOTTKY AND PROGRAMMABLE AND BIPOLAR
output_logic_formTRANSISTOR-TRANSISTOR LOGIC
inclosure_materialCERAMIC
memory_device_typeROM
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern10 INPUT
inclosure_configurationDUAL-IN-LINE
terminal_surface_treatmentSOLDER
NSN5962-01-230-9595
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN 5882733 MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
INPUT CIRCUIT PATTERN: 10 INPUT
•
INCLOSURE MATERIAL: CERAMIC
•
TERMINAL SURFACE TREATMENT: SOLDER
•
BODY WIDTH: 0.310 INCHES MAXIMUM IN
•
BODY HEIGHT: 0.185 INCHES MAXIMUM IN
•
FEATURES PROVIDED: MONOLITHIC AND SCHOTTKY AND PROGRAMMABLE AND BIPOLAR
•
INCLOSURE CONFIGURATION: DUAL-IN-LINE
•
MEMORY DEVICE TYPE: ROM
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS
INPUT CIRCUIT PATTERN10 INPUT
INCLOSURE MATERIALCERAMIC
TERMINAL SURFACE TREATMENTSOLDER
BODY WIDTH0.310 INCHES MAXIMUM IN
BODY HEIGHT0.185 INCHES MAXIMUM IN
FEATURES PROVIDEDMONOLITHIC AND SCHOTTKY AND PROGRAMMABLE AND BIPOLAR
INCLOSURE CONFIGURATIONDUAL-IN-LINE
MEMORY DEVICE TYPEROM
CASE OUTLINE SOURCE AND DESIGNATORD-2 MIL-M-38510
BODY LENGTH0.840 INCHES MAXIMUM IN
OTHER ITEMS IN FSC 5962 — Microcircuits, Electronic
Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.
5962-00-001-1861 5962-00-001-1901 5962-00-001-1902 5962-00-001-1905 5962-00-001-1906 5962-00-001-1907 5962-00-001-1908 5962-00-001-1909
SUBSTITUTES & CROSS-REFERENCES 3
JM38510/20302BEBReference document
Same NSN cross-reference
Reference document — Secondary reference
ROM/PROMReference document
Same NSN cross-reference
Reference document — Secondary reference
L537111095Same NSN cross-reference
Same NSN cross-reference
Also cataloged under this NSN
LIFECYCLE
NSN statusActive· U.S. Government catalog
Acquisition advice: Terminal item — stock exhausted; no further procurementDemilitarization required — critical (Q)
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FREQUENTLY ASKED QUESTIONS
What is 5882733?
5882733 is a MICROCIRCUIT,MEMORY.
What parts can replace 5882733?
There are 3 known substitutes for 5882733: JM38510/20302BEB, ROM/PROM, L537111095. Substitute compatibility should be verified for your specific system.
What is the NSN for 5882733?
5882733 is cataloged in the U.S. Government catalog under NSN 5962-01-230-9595. This indicates validated use in U.S. government and defense supply chains.
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