588.10-400000-019: SEALING COMPOUND.
The SEALING COMPOUND is a the manufacturer industrial component. Key specifications include material: SILICONE, temp_rating: 500.0 FAHRENHEIT DEGF, physical_form: LIQUID, special_features: HIGH TEMPERATURE, STORE BELOW 80 DEG F AND SHIP AT AMBIENT TEMPERATURE. DEGF, rated_drying_time: 30.000 MINUTES NOMINAL, specific_usage_design: FOR POTTING ELECTRICAL/ELECTRONIC COMPONENTS.
This part is cataloged in the U.S. Government catalog under NSN 8030-01-119-1901, indicating validated use in U.S. government and defense logistics supply chains.
Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels. Verify compatibility with your specific system configuration before ordering.
| material | SILICONE |
| temp_rating | 500.0 FAHRENHEIT DEGF |
| physical_form | LIQUID |
| special_features | HIGH TEMPERATURE, STORE BELOW 80 DEG F AND SHIP AT AMBIENT TEMPERATURE. DEGF |
| rated_drying_time | 30.000 MINUTES NOMINAL |
| specific_usage_design | FOR POTTING ELECTRICAL/ELECTRONIC COMPONENTS |
| supplementary_features | 10.3 OUNCE TUBE OZ |
| quantity_within_each_unit_package | 10.300 OUNCES OZ |
| NSN | 8030-01-119-1901 |
| TEMP RATING | 500.0 FAHRENHEIT DEGF |
| RATED DRYING TIME | 30.000 MINUTES NOMINAL |
| SUPPLEMENTARY FEATURES | 10.3 OUNCE TUBE OZ |
| QUANTITY WITHIN EACH UNIT PACKAGE | 10.300 OUNCES OZ |
| PHYSICAL FORM | LIQUID |
| COLOR | RED |
| SPECIAL FEATURES | HIGH TEMPERATURE, STORE BELOW 80 DEG F AND SHIP AT AMBIENT TEMPERATURE. DEGF |
| SPECIFIC USAGE DESIGN | FOR POTTING ELECTRICAL/ELECTRONIC COMPONENTS |
| MATERIAL | SILICONE |