587R136H02 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

587R136H02: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.700 INCHES NOMINAL IN, body_height: 0.100 INCHES MAXIMUM IN, body_length: 0.700 INCHES NOMINAL IN, features_provided: HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND POSITIVE OUTPUTS, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, precious_material: GOLD. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-177-9183, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

587R136H02

NSN: 5962-01-177-9183
FSC: 5962 — Microcircuits, Electronic
CAGE: 67067 — GENERAL ELECTRIC CO CUSTOM INTERGRATED CIRCUIT DEPT (USA)

SPECIFICATIONS

body_width	0.700 INCHES NOMINAL IN
body_height	0.100 INCHES MAXIMUM IN
body_length	0.700 INCHES NOMINAL IN
features_provided	HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND POSITIVE OUTPUTS
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
precious_material	GOLD
inclosure_material	METAL
memory_device_type	PAL
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
inclosure_configuration	BEAM CHIP
NSN	5962-01-177-9183

COMPONENT DIAGRAM

KEY FEATURES

•

INCLOSURE MATERIAL: METAL

•

TERMINAL SURFACE TREATMENT: SOLDER

•

PRECIOUS MATERIAL: GOLD

•

BODY WIDTH: 0.700 INCHES NOMINAL IN

•

BODY HEIGHT: 0.100 INCHES MAXIMUM IN

•

FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND POSITIVE OUTPUTS

•

INCLOSURE CONFIGURATION: BEAM CHIP

•

CURRENT RATING PER CHARACTERISTIC: 91.00 MILLIAMPERES MAXIMUM SUPPLY

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INCLOSURE MATERIAL	METAL
TERMINAL SURFACE TREATMENT	SOLDER
PRECIOUS MATERIAL	GOLD
BODY WIDTH	0.700 INCHES NOMINAL IN
BODY HEIGHT	0.100 INCHES MAXIMUM IN
FEATURES PROVIDED	HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND POSITIVE OUTPUTS
INCLOSURE CONFIGURATION	BEAM CHIP
CURRENT RATING PER CHARACTERISTIC	91.00 MILLIAMPERES MAXIMUM SUPPLY
MEMORY DEVICE TYPE	PAL
BODY LENGTH	0.700 INCHES NOMINAL IN

OTHER ITEMS IN FSC 5962 — Microcircuits, Electronic

Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.

5962-00-001-1861 5962-00-001-1901 5962-00-001-1902 5962-00-001-1905 5962-00-001-1906 5962-00-001-1907 5962-00-001-1908 5962-00-001-1909

SUBSTITUTES & CROSS-REFERENCES 2

585R997H01Reference document

Same NSN cross-reference

Reference document — Secondary reference

WECW006F4A/5966Reference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Demilitarization required — mutilation + specific procedure

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FREQUENTLY ASKED QUESTIONS

What is 587R136H02?

587R136H02 is a MICROCIRCUIT,MEMORY.

What parts can replace 587R136H02?

There are 2 known substitutes for 587R136H02: 585R997H01, WECW006F4A/5966. Substitute compatibility should be verified for your specific system.

What is the NSN for 587R136H02?

587R136H02 is cataloged in the U.S. Government catalog under NSN 5962-01-177-9183. This indicates validated use in U.S. government and defense supply chains.

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