586R554H01: MICROCIRCUIT,DIGITAL.
The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.235 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN, body_height: 0.045 INCHES MINIMUM AND 0.085 INCHES MAXIMUM IN, body_length: 0.390 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND MONOLITHIC, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC OR GLASS OR METAL. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-209-2832, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.235 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN |
| body_height | 0.045 INCHES MINIMUM AND 0.085 INCHES MAXIMUM IN |
| body_length | 0.390 INCHES MAXIMUM IN |
| features_provided | HERMETICALLY SEALED AND MONOLITHIC |
| output_logic_form | TRANSISTOR-TRANSISTOR LOGIC |
| inclosure_material | CERAMIC OR GLASS OR METAL |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | QUAD 2 INPUT |
| inclosure_configuration | FLAT PACK |
| terminal_surface_treatment | SOLDER |
| terminal_type_and_quantity | 14 FLAT LEADS |
| NSN | 5962-01-209-2832 |
| INPUT CIRCUIT PATTERN | QUAD 2 INPUT |
| INCLOSURE MATERIAL | CERAMIC OR GLASS OR METAL |
| TERMINAL SURFACE TREATMENT | SOLDER |
| DESIGN FUNCTION AND QUANTITY | 4 BUFFER, TRI-STATE |
| BODY WIDTH | 0.235 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN |
| BODY HEIGHT | 0.045 INCHES MINIMUM AND 0.085 INCHES MAXIMUM IN |
| FEATURES PROVIDED | HERMETICALLY SEALED AND MONOLITHIC |
| INCLOSURE CONFIGURATION | FLAT PACK |
| CASE OUTLINE SOURCE AND DESIGNATOR | F-2 MIL-M-38510 |
| BODY LENGTH | 0.390 INCHES MAXIMUM IN |
No substitute or cross-reference records for this part.