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Technical Data Sheet
585R727H09 ✓ Verified by PartsTable
· COMPONENT
WHAT YOU NEED TO KNOW
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PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN, body_height: 0.130 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN, body_length: 1.060 INCHES MAXIMUM IN, features_provided: ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND BURN IN AND STATIC OPERATION, output_logic_form: N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-198-0461, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
585R727H09
NSN: 5962-01-198-0461
FSC: 5962
CAGE: 65786 — INFINEON TECHNOLOGIES AMERICAS CORP. (USA)
SPECIFICATIONS
body_width0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
body_height0.130 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN
body_length1.060 INCHES MAXIMUM IN
features_providedELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND BURN IN AND STATIC OPERATION
output_logic_formN-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_materialCERAMIC
memory_device_typeRAM
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
test_data_document96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern17 INPUT
inclosure_configurationDUAL-IN-LINE
NSN5962-01-198-0461
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN 585R727H09 MFR MICROCIRCUIT,MEMORY
KEY FEATURES
OUTPUT LOGIC FORM: N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
TEST DATA DOCUMENT: 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
CASE OUTLINE SOURCE AND DESIGNATOR: D-8 MIL-M-38510
TERMINAL TYPE AND QUANTITY: 20 PRINTED CIRCUIT
TIME RATING PER CHACTERISTIC: 120.00 NANOSECONDS MAXIMUM DELAY NS
CURRENT RATING PER CHARACTERISTIC: 120.00 MILLIAMPERES MAXIMUM SUPPLY
TERMINAL SURFACE TREATMENT: SOLDER
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS (FLIS)
OUTPUT LOGIC FORMN-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
TEST DATA DOCUMENT96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
CASE OUTLINE SOURCE AND DESIGNATORD-8 MIL-M-38510
TERMINAL TYPE AND QUANTITY20 PRINTED CIRCUIT
TIME RATING PER CHACTERISTIC120.00 NANOSECONDS MAXIMUM DELAY NS
CURRENT RATING PER CHARACTERISTIC120.00 MILLIAMPERES MAXIMUM SUPPLY
TERMINAL SURFACE TREATMENTSOLDER
VOLTAGE RATING AND TYPE PER CHARACTERISTIC-0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE
MEMORY DEVICE TYPERAM
BODY HEIGHT0.130 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN
VERIFIED SUBSTITUTES & CROSS-REFERENCES 10
0-304Interchangeable
interchangeable cross-reference
interchangeable
3 V1AInterchangeable
interchangeable cross-reference
interchangeable
120645Interchangeable
interchangeable cross-reference
interchangeable
B107.500Interchangeable
interchangeable cross-reference
interchangeable
139-477-002Interchangeable
interchangeable cross-reference
interchangeable
63A140388P354-5Interchangeable
interchangeable cross-reference
interchangeable
LIFECYCLE
StatusACTIVE
AvailabilityOEM and secondary market
RoHS CompliantEAR99ESD SensitiveNot HAZMAT
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FREQUENTLY ASKED QUESTIONS
What is 585R727H09?
585R727H09 is a MICROCIRCUIT,MEMORY.
What parts can replace 585R727H09?
There are 10 known substitutes for 585R727H09: 0-304, 3 V1A, 120645 and 7 more. Substitute compatibility should be verified for your specific system.
What is the NSN for 585R727H09?
585R727H09 is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-198-0461. This indicates validated use in U.S. government and defense supply chains.
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