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Technical Data Sheet
PartsTable / COMPONENT / 5812749P1
5812749P1 ✓ Verified by PartsTable
— · COMPONENT
WHAT YOU NEED TO KNOW
Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel
Confirm exact part number — similar PNs may be different parts
PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN, body_height: 0.130 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN, body_length: 1.060 INCHES MAXIMUM IN, features_provided: MONOLITHIC AND PROGRAMMED AND BIPOLAR, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-255-0369, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
5812749P1
NSN: 5962-01-255-0369
FSC: 5962
CAGE: 94117 — BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC. DBA BAE SYSTEMS (USA)
SPECIFICATIONS
body_width0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
body_height0.130 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN
body_length1.060 INCHES MAXIMUM IN
features_providedMONOLITHIC AND PROGRAMMED AND BIPOLAR
output_logic_formTRANSISTOR-TRANSISTOR LOGIC
inclosure_materialCERAMIC
memory_device_typePAL
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
test_data_document96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern10 INPUT
inclosure_configurationDUAL-IN-LINE
NSN5962-01-255-0369
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN 5812749P1 MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
INPUT CIRCUIT PATTERN: 10 INPUT
•
MAXIMUM POWER DISSIPATION RATING: 100.0 MILLIWATTS
•
BODY WIDTH: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
•
TIME RATING PER CHACTERISTIC: 45.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT AND 45.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT NS
•
CURRENT RATING PER CHARACTERISTIC: 90.00 MILLIAMPERES MAXIMUM SUPPLY
•
MEMORY DEVICE TYPE: PAL
•
STORAGE TEMP RANGE: -65.0 TO 150.0 CELSIUS DEGC
•
TERMINAL SURFACE TREATMENT: SOLDER
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS (FLIS)
INPUT CIRCUIT PATTERN10 INPUT
MAXIMUM POWER DISSIPATION RATING100.0 MILLIWATTS
BODY WIDTH0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
TIME RATING PER CHACTERISTIC45.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT AND 45.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT NS
CURRENT RATING PER CHARACTERISTIC90.00 MILLIAMPERES MAXIMUM SUPPLY
MEMORY DEVICE TYPEPAL
STORAGE TEMP RANGE-65.0 TO 150.0 CELSIUS DEGC
TERMINAL SURFACE TREATMENTSOLDER
CASE OUTLINE SOURCE AND DESIGNATORD-8 MIL-M-38510
TERMINAL TYPE AND QUANTITY20 PRINTED CIRCUIT
VERIFIED SUBSTITUTES & CROSS-REFERENCES 18
PAL10L8Interchangeable
interchangeable cross-reference
interchangeable
FR551-1210-082NInterchangeable
interchangeable cross-reference
interchangeable
5962-3850306BRBInterchangeable
interchangeable cross-reference
interchangeable
M38510/50306BRAInterchangeable
interchangeable cross-reference
interchangeable
319R465H01Interchangeable
interchangeable cross-reference
interchangeable
ROM/PROM FAMILY 073Interchangeable
interchangeable cross-reference
interchangeable
LIFECYCLE
StatusACTIVE
AvailabilityOEM and secondary market
RoHS CompliantEAR99ESD SensitiveNot HAZMAT
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FREQUENTLY ASKED QUESTIONS
What is 5812749P1?
5812749P1 is a MICROCIRCUIT,MEMORY.
What parts can replace 5812749P1?
There are 18 known substitutes for 5812749P1: PAL10L8, FR551-1210-082N, 5962-3850306BRB and 15 more. Substitute compatibility should be verified for your specific system.
What is the NSN for 5812749P1?
5812749P1 is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-255-0369. This indicates validated use in U.S. government and defense supply chains.
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Last verified: July 2026