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Technical Data Sheet
PartsTable / COMPONENT / 5729212-2
5729212-2 ✓ Verified by PartsTable
— · COMPONENT
WHAT YOU NEED TO KNOW
Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel
Confirm exact part number — similar PNs may be different parts
PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN, body_height: 0.185 INCHES MAXIMUM IN, body_length: 1.060 INCHES MAXIMUM IN, features_provided: BURN IN AND BIPOLAR AND HERMETICALLY SEALED AND HIGH SPEED AND MONOLITHIC AND PROGRAMMED, inclosure_material: CERAMIC, memory_device_type: PROM. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-308-6809, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
5729212-2
NSN: 5962-01-308-6809
FSC: 5962
CAGE: 53711 — NAVAL SEA SYSTEMS COMMAND (USA)
SPECIFICATIONS
body_width0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
body_height0.185 INCHES MAXIMUM IN
body_length1.060 INCHES MAXIMUM IN
features_providedBURN IN AND BIPOLAR AND HERMETICALLY SEALED AND HIGH SPEED AND MONOLITHIC AND PROGRAMMED
inclosure_materialCERAMIC
memory_device_typePROM
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
test_data_document96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern13 INPUT
inclosure_configurationDUAL-IN-LINE
terminal_surface_treatmentSOLDER
NSN5962-01-308-6809
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN 5729212-2 MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
INCLOSURE CONFIGURATION: DUAL-IN-LINE
•
TEST DATA DOCUMENT: 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
•
CASE OUTLINE SOURCE AND DESIGNATOR: D-8 MIL-M-38510
•
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE
•
TERMINAL SURFACE TREATMENT: SOLDER
•
TERMINAL TYPE AND QUANTITY: 20 PRINTED CIRCUIT
•
MEMORY DEVICE TYPE: PROM
•
TIME RATING PER CHACTERISTIC: 70.00 NANOSECONDS MAXIMUM ACCESS NS
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS (FLIS)
INCLOSURE CONFIGURATIONDUAL-IN-LINE
TEST DATA DOCUMENT96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
CASE OUTLINE SOURCE AND DESIGNATORD-8 MIL-M-38510
VOLTAGE RATING AND TYPE PER CHARACTERISTIC-0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE
TERMINAL SURFACE TREATMENTSOLDER
TERMINAL TYPE AND QUANTITY20 PRINTED CIRCUIT
MEMORY DEVICE TYPEPROM
TIME RATING PER CHACTERISTIC70.00 NANOSECONDS MAXIMUM ACCESS NS
MAXIMUM POWER DISSIPATION RATING880.0 MILLIWATTS
STORAGE TEMP RANGE-65.0 TO 150.0 CELSIUS DEGC
VERIFIED SUBSTITUTES & CROSS-REFERENCES 6
5962-8769001BRXInterchangeable
interchangeable cross-reference
interchangeable
5962-8769001RAInterchangeable
interchangeable cross-reference
interchangeable
5962-8769001RBInterchangeable
interchangeable cross-reference
interchangeable
AM27S29/BRAInterchangeable
Same NIIN cross-reference
interchangeable
5962-8769001RXInterchangeable
Same NIIN cross-reference
interchangeable
ROM/PROM FAMILY 170Interchangeable
Same NIIN cross-reference
interchangeable
LIFECYCLE
StatusACTIVE
AvailabilityOEM and secondary market
RoHS CompliantEAR99ESD SensitiveNot HAZMAT
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FREQUENTLY ASKED QUESTIONS
What is 5729212-2?
5729212-2 is a MICROCIRCUIT,MEMORY.
What parts can replace 5729212-2?
There are 6 known substitutes for 5729212-2: 5962-8769001BRX, 5962-8769001RA, 5962-8769001RB and 3 more. Substitute compatibility should be verified for your specific system.
What is the NSN for 5729212-2?
5729212-2 is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-308-6809. This indicates validated use in U.S. government and defense supply chains.
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✓ Validated with multiple authoritative sources, including Government, OEM, and Certified sources.
PartsTable Design LLC · partstable.com
Last verified: July 2026