5727422-1 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

5727422-1: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include special_features: 65,536 X 1 BIT, features_provided: BURN IN AND MONOLITHIC AND DYNAMIC, output_logic_form: N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: SILICON, memory_device_type: ROM, operating_temp_range: +0.0 TO 85.0 CELSIUS DEGC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-310-7968, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

5727422-1

NSN: 5962-01-310-7968
FSC: 5962 — Microcircuits, Electronic
CAGE: 53711 — NAVAL SEA SYSTEMS COMMAND (USA)

SPECIFICATIONS

special_features	65,536 X 1 BIT
features_provided	BURN IN AND MONOLITHIC AND DYNAMIC
output_logic_form	N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	SILICON
memory_device_type	ROM
operating_temp_range	+0.0 TO 85.0 CELSIUS DEGC
end_item_identification	FORWARD CARD BOX ASSEMBLY
inclosure_configuration	DUAL-IN-LINE
terminal_surface_treatment	SOLDER
case_outline_source_and_designator	D-2 MIL-M-38510
NSN	5962-01-310-7968

COMPONENT DIAGRAM

KEY FEATURES

•

INCLOSURE MATERIAL: SILICON

•

TERMINAL SURFACE TREATMENT: SOLDER

•

FEATURES PROVIDED: BURN IN AND MONOLITHIC AND DYNAMIC

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: ROM

•

CASE OUTLINE SOURCE AND DESIGNATOR: D-2 MIL-M-38510

•

OUTPUT LOGIC FORM: N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INCLOSURE MATERIAL	SILICON
TERMINAL SURFACE TREATMENT	SOLDER
FEATURES PROVIDED	BURN IN AND MONOLITHIC AND DYNAMIC
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	ROM
CASE OUTLINE SOURCE AND DESIGNATOR	D-2 MIL-M-38510
OUTPUT LOGIC FORM	N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
SPECIAL FEATURES	65,536 X 1 BIT
OPERATING TEMP RANGE	+0.0 TO 85.0 CELSIUS DEGC
END ITEM IDENTIFICATION	FORWARD CARD BOX ASSEMBLY

OTHER ITEMS IN FSC 5962 — Microcircuits, Electronic

Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.

5962-00-001-1861 5962-00-001-1901 5962-00-001-1902 5962-00-001-1905 5962-00-001-1906 5962-00-001-1907 5962-00-001-1908 5962-00-001-1909

SUBSTITUTES & CROSS-REFERENCES

No substitute or cross-reference records for this part.

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandNo demilitarization required

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FREQUENTLY ASKED QUESTIONS

What is 5727422-1?

5727422-1 is a MICROCIRCUIT,MEMORY.

What is the NSN for 5727422-1?

5727422-1 is cataloged in the U.S. Government catalog under NSN 5962-01-310-7968. This indicates validated use in U.S. government and defense supply chains.

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5727422-1 — MICROCIRCUIT,MEMORY

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