56F725-001: FILTER ASSEMBLY,ELECTRICAL.
The FILTER ASSEMBLY,ELECTRICAL is a the manufacturer industrial component. Key specifications include filter_type: BAND PASS, overall_width: 25.30 MILLIMETERS MINIMUM AND 25.55 MILLIMETERS MAXIMUM MM, overall_height: 12.70 MILLIMETERS MINIMUM AND 12.95 MILLIMETERS MAXIMUM MM, overall_length: 52.91 MILLIMETERS MINIMUM AND 53.16 MILLIMETERS MAXIMUM MM, terminal_type_and_quantity: 1 CONNECTOR, PLUG AND 1 CONNECTOR, RECEPTACLE, assembly_construction_method: MOUNTED BETWEEN TERMINALS. This part is cataloged in the U.S.
Government catalog under NSN 5915-01-702-7472, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| filter_type | BAND PASS |
| overall_width | 25.30 MILLIMETERS MINIMUM AND 25.55 MILLIMETERS MAXIMUM MM |
| overall_height | 12.70 MILLIMETERS MINIMUM AND 12.95 MILLIMETERS MAXIMUM MM |
| overall_length | 52.91 MILLIMETERS MINIMUM AND 53.16 MILLIMETERS MAXIMUM MM |
| filter_quantity | 1 |
| terminal_type_and_quantity | 1 CONNECTOR, PLUG AND 1 CONNECTOR, RECEPTACLE |
| assembly_construction_method | MOUNTED BETWEEN TERMINALS |
| precious_material_and_location | CONTACT PLATING, TERMINATIONS GOLD |
| part_name_assigned_by_controlling_agency | 5G EMI FILTER D-SUB CONNECTOR/SERIES 700 HIGH PERFORMANCE FILTERED CONNECTORS G |
| NSN | 5915-01-702-7472 |
| OVERALL HEIGHT | 12.70 MILLIMETERS MINIMUM AND 12.95 MILLIMETERS MAXIMUM MM |
| FILTER TYPE | BAND PASS |
| FILTER QUANTITY | 1 |
| OVERALL LENGTH | 52.91 MILLIMETERS MINIMUM AND 53.16 MILLIMETERS MAXIMUM MM |
| OVERALL WIDTH | 25.30 MILLIMETERS MINIMUM AND 25.55 MILLIMETERS MAXIMUM MM |
| SPECIAL FEATURES | SHELL: ZINC OR ALUMINUM DIECAST, NICKEL PLATED 150 MICRO INCHES (3.81 MICRO M) MIN. INSULATORS: GLASS-FILLED POLYESTER, FLAMMABILITY UL94V-0. PIN CONTACTS: COPPER ALLOY, 15 MICRO INCHES (0.38 MICRO M) GOLD PLATED OVER NICKEL. SOCKET CONTACTS: COPPER ALLOY, 30 MICRO INCHES (0.76 MICRO M) GOLD PLATED OVER NICKEL. TERMINATIONS: GOLD FLASH FOR PCB MOUNT AND SOLDER CUPS. GROUND PLANE: BRASS, SOLDER PLATED. GROUNDING SPRINGS: BERYLLIUM COPPER, TIN PLATED PER MIL-T-10727. OPERATING TEMPERATURE: -55 DEG C TO +125 DEG C. CURRENT RATING: 5 AMPS. CAPACITANCE VALUE: 310 PF PI. ROHS 3. DEGC |
| PRECIOUS MATERIAL AND LOCATION | CONTACT PLATING, TERMINATIONS GOLD |
| PART NAME ASSIGNED BY CONTROLLING AGENCY | 5G EMI FILTER D-SUB CONNECTOR/SERIES 700 HIGH PERFORMANCE FILTERED CONNECTORS G |
| ASSEMBLY CONSTRUCTION METHOD | MOUNTED BETWEEN TERMINALS |
| TERMINAL TYPE AND QUANTITY | 1 CONNECTOR, PLUG AND 1 CONNECTOR, RECEPTACLE |
No substitute or cross-reference records for this part.