The SEMICONDUCTOR DEVICE,DIODE is a the manufacturer industrial component. Key specifications include special_features: MATERIAL - EPOXY RESIN; DIAMETER 2.50 IN.; USED ON SHIPBOARD COMPUTER IN. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5895-01-184-3803, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| special_features | MATERIAL - EPOXY RESIN; DIAMETER 2.50 IN.; USED ON SHIPBOARD COMPUTER IN |
| NSN | 5895-01-184-3803 |
| SPECIAL FEATURES | MATERIAL - EPOXY RESIN; DIAMETER 2.50 IN.; USED ON SHIPBOARD COMPUTER IN |
| SPECIAL FEATURES | MATERIAL - EPOXY RESIN; DIAMETER 2.50 IN.; USED ON SHIPBOARD COMPUTER IN |