The CIRCUIT CARD ASSEMBLY is a the manufacturer industrial component. Key specifications include color: BLACK, overall_depth: 0.625 INCHES NOMINAL IN, overall_height: 0.468 INCHES MAXIMUM IN, inside_diameter: 0.250 INCHES NOMINAL IN, outside_diameter: 1.000 INCHES MAXIMUM IN, screw_drive_type: HEXAGON SOCKET. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5998-01-223-0689, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| color | BLACK |
| overall_depth | 0.625 INCHES NOMINAL IN |
| overall_height | 0.468 INCHES MAXIMUM IN |
| inside_diameter | 0.250 INCHES NOMINAL IN |
| outside_diameter | 1.000 INCHES MAXIMUM IN |
| screw_drive_type | HEXAGON SOCKET |
| style_designator | ROUND |
| attachment_method | SETSCREWS |
| overall_thickness | 0.719 INCHES NOMINAL IN |
| reference_marking | BRILL |
| setscrew_hole_quantity | 2 |
| shaft_accommodation_style | ROUND |
| NSN | 5998-01-223-0689 |
| OVERALL HEIGHT | 0.468 INCHES MAXIMUM IN |
| SPECIAL FEATURES | CAPACITOR,FIXED,CERAMIC DIELECTRIC 11; CAPACITOR,FIXED,ELECTROLYTIC 3; CAPACITOR,FIXED,GLASS DIELECTRIC 2; CONNECTOR,PLUG,ELECTRICAL 1; CONNECTOR,ELECTRICAL,MODULAR 2; COIL,RADIO FREQUENCY 1; SEMICONDUCTOR DEVICE,DIODE,SILICON 1; MICROCIRCUIT,DIGITAL 38; MICROCIRCUIT,LINEAR 1; PRINTED WIRING BOARD 1; RESISTOR,FIXED,FILM 17; TERMINAL,TURRET 1 |
| OVERALL HEIGHT | 0.468 INCHES MAXIMUM IN |
| SPECIAL FEATURES | CAPACITOR,FIXED,CERAMIC DIELECTRIC 11; CAPACITOR,FIXED,ELECTROLYTIC 3; CAPACITOR,FIXED,GLASS DIELECTRIC 2; CONNECTOR,PLUG,ELECTRICAL 1; CONNECTOR,ELECTRICAL,MODULAR 2; COIL,RADIO FREQUENCY 1; SEMICONDUCTOR DEVICE,DIODE,SILICON 1; MICROCIRCUIT,DIGITAL 38; MICROCIRCUIT,LINEAR 1; PRINTED WIRING BOARD 1; RESISTOR,FIXED,FILM 17; TERMINAL,TURRET 1 |