5531D/883B — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

5531D/883B: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN, body_height: 0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN, body_length: 0.840 INCHES MAXIMUM IN, memory_capacity: UNKNOWN, features_provided: HERMETICALLY SEALED AND W/ENABLE AND 3-STATE OUTPUT, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-104-9539, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

5531D/883B

NSN: 5962-01-104-9539
FSC: 5962 — Microcircuits, Electronic
CAGE: 50364 — MMI/AMD (USA)

SPECIFICATIONS

body_width	0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
body_height	0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN
body_length	0.840 INCHES MAXIMUM IN
memory_capacity	UNKNOWN
features_provided	HERMETICALLY SEALED AND W/ENABLE AND 3-STATE OUTPUT
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	RAM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	13 INPUT
NSN	5962-01-104-9539

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 13 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN

•

FEATURES PROVIDED: HERMETICALLY SEALED AND W/ENABLE AND 3-STATE OUTPUT

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: RAM

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	13 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
BODY HEIGHT	0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN
FEATURES PROVIDED	HERMETICALLY SEALED AND W/ENABLE AND 3-STATE OUTPUT
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	RAM
CASE OUTLINE SOURCE AND DESIGNATOR	D-2 MIL-M-38510
BODY LENGTH	0.840 INCHES MAXIMUM IN

SUBSTITUTES & CROSS-REFERENCES

No substitute or cross-reference records for this part.

LIFECYCLE

NSN statusActive· U.S. Government catalog

Demilitarization required — critical (Q)

Ready to buy 5531D/883B?

Compare prices from verified sellers on eBay

Buy on eBay →

As an eBay Partner, PartsTable may earn a commission. Your price is not affected.

FREQUENTLY ASKED QUESTIONS

What is 5531D/883B?

5531D/883B is a MICROCIRCUIT,MEMORY.

What is the NSN for 5531D/883B?

5531D/883B is cataloged in the U.S. Government catalog under NSN 5962-01-104-9539. This indicates validated use in U.S. government and defense supply chains.

Community Feedback

5531D/883B — MICROCIRCUIT,MEMORY

Request a Quote — 5531D/883B