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Technical Data Sheet
55107BDM ✓ Verified by PartsTable
· COMPONENT
WHAT YOU NEED TO KNOW
Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel
Confirm exact part number — similar PNs may be different parts
PRODUCT OVERVIEW

The MICROCIRCUIT,LINEAR is a the manufacturer industrial component. Key specifications include body_width: 0.250 INCHES NOMINAL IN, body_height: 0.200 INCHES NOMINAL IN, body_length: 0.770 INCHES NOMINAL IN, features_provided: HERMETICALLY SEALED, inclosure_material: CERAMIC, storage_temp_range: -65.0 TO 150.0 CELSIUS DEGC. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-037-9357, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
55107BDM
NSN: 5962-01-037-9357
FSC: 5962
CAGE: 07263 — FAIRCHILD SEMICONDUCTOR CORP (USA)
SPECIFICATIONS
body_width0.250 INCHES NOMINAL IN
body_height0.200 INCHES NOMINAL IN
body_length0.770 INCHES NOMINAL IN
features_providedHERMETICALLY SEALED
inclosure_materialCERAMIC
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
test_data_document81349-MIL-STD-883 CONDITION B STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern2 INPUT
inclosure_configurationDUAL-IN-LINE
terminal_surface_treatmentTIN
design_function_and_quantity2 RECEIVER, LINE
NSN5962-01-037-9357
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,LINEAR TITLE COMPONENT PN 55107BDM MFR MICROCIRCUIT,LINEAR
KEY FEATURES
TERMINAL SURFACE TREATMENT: TIN
STORAGE TEMP RANGE: -65.0 TO 150.0 CELSIUS DEGC
INCLOSURE MATERIAL: CERAMIC
BODY LENGTH: 0.770 INCHES NOMINAL IN
FEATURES PROVIDED: HERMETICALLY SEALED
TEST DATA DOCUMENT: 81349-MIL-STD-883 CONDITION B STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
BODY HEIGHT: 0.200 INCHES NOMINAL IN
BODY WIDTH: 0.250 INCHES NOMINAL IN
TECHNICAL CHARACTERISTICS (FLIS)
TERMINAL SURFACE TREATMENTTIN
STORAGE TEMP RANGE-65.0 TO 150.0 CELSIUS DEGC
INCLOSURE MATERIALCERAMIC
BODY LENGTH0.770 INCHES NOMINAL IN
FEATURES PROVIDEDHERMETICALLY SEALED
TEST DATA DOCUMENT81349-MIL-STD-883 CONDITION B STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
BODY HEIGHT0.200 INCHES NOMINAL IN
BODY WIDTH0.250 INCHES NOMINAL IN
OPERATING TEMP RANGE-55.0 TO 125.0 CELSIUS DEGC
INPUT CIRCUIT PATTERN2 INPUT
VERIFIED SUBSTITUTES & CROSS-REFERENCES 12
SN75107BNE4Interchangeable
interchangeable cross-reference
interchangeable
M38510/10401BCAInterchangeable
interchangeable cross-reference
interchangeable
SN55107AJ00Interchangeable
interchangeable cross-reference
interchangeable
1854380Interchangeable
Same NIIN cross-reference
interchangeable
1757-2165Interchangeable
Same NIIN cross-reference
interchangeable
G639108Interchangeable
Same NIIN cross-reference
interchangeable
LIFECYCLE
StatusACTIVE
AvailabilityOEM and secondary market
RoHS CompliantEAR99ESD SensitiveNot HAZMAT
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FREQUENTLY ASKED QUESTIONS
What is 55107BDM?
55107BDM is a MICROCIRCUIT,LINEAR.
What parts can replace 55107BDM?
There are 12 known substitutes for 55107BDM: SN75107BNE4, M38510/10401BCA, SN55107AJ00 and 9 more. Substitute compatibility should be verified for your specific system.
What is the NSN for 55107BDM?
55107BDM is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-037-9357. This indicates validated use in U.S. government and defense supply chains.
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