550-0103: SEMICONDUCTOR DEVICE ASSEMBLY.
The SEMICONDUCTOR DEVICE ASSEMBLY is a the manufacturer industrial component. Key specifications include material: PLASTIC ENCLOSURE, overall_width: 0.245 INCHES MAXIMUM IN, overall_height: 0.245 INCHES MAXIMUM IN, overall_length: 0.425 INCHES NOMINAL IN, mounting_method: TERMINAL, terminal_length: 0.375 INCHES MINIMUM IN. This part is cataloged in the U.S.
Government catalog under NSN 5980-01-023-8417, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| material | PLASTIC ENCLOSURE |
| overall_width | 0.245 INCHES MAXIMUM IN |
| overall_height | 0.245 INCHES MAXIMUM IN |
| overall_length | 0.425 INCHES NOMINAL IN |
| mounting_method | TERMINAL |
| terminal_length | 0.375 INCHES MINIMUM IN |
| features_provided | BURN IN |
| lens_transparency | TRANSLUCENT |
| luminous_intensity | 0.5 MILLICANDELA MINIMUM AND 3.0 MILLICANDELA MAXIMUM |
| fsc_application_data | INTERFACE SUBASSEMBLY |
| internal_configuration | POINT CONTACT |
| semiconductor_material | GALLIUM ARSENIDE PHOSPHIDE |
| NSN | 5980-01-023-8417 |
| OVERALL HEIGHT | 0.245 INCHES MAXIMUM IN |
| VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 3.0 MAXIMUM REVERSE VOLTAGE, INSTANTANEOUS |
| MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 100.0 CELSIUS AMBIENT AIR DEGC |
| TERMINAL LENGTH | 0.375 INCHES MINIMUM IN |
| MOUNTING METHOD | TERMINAL |
| INTERNAL JUNCTION CONFIGURATION | PN |
| SEMICONDUCTOR MATERIAL | GALLIUM ARSENIDE PHOSPHIDE |
| LUMINOUS INTENSITY | 0.5 MILLICANDELA MINIMUM AND 3.0 MILLICANDELA MAXIMUM |
| OVERALL LENGTH | 0.425 INCHES NOMINAL IN |
| INTERNAL CONFIGURATION | POINT CONTACT |